2024 OCP Future Technologies Symposium (2024 OCP EMEA Regional Summit)

24 April 2024, Lisbon, Portugal

Title Speaker(s)
OCP FTS Welcome and Kickoff
  • Lesya Dymyd, OCP Future Technologies Symposium Chair, OCP
Video Slides
Silicon Dreams: Toward the AI Singularity
  • Dharmesh Jani, OCP IC Co-Chair and Meta Infra Ecosystem Lead, Meta
Video Slides
Breaking the barrier, chip level cooling up to and beyond 1000W in single phase dielectric fluid
  • Kelley Mullick, Vice President, Iceotope Technologies
Video Slides
Direct-to-chip, Two-Phase Cooling Performance Metrics and PFAS Sustainability
  • Richard Bonner, CTO, Accelsius
Video Slides
Chiplet-Based Compressed LLC Cache & Memory Expansion
  • Nilesh Shah, VP Business Development, zeropoint technologies
Video Slides
Ceramic Nano Memory enabling the AI Storage Dataverse
  • Steffen Hellmold, Director, Cerabyte- Inc.
  • Christian Pflaum, CEO, Cerabyte- Inc.
Video Slides
Air or liquid cooled servers – the right product for the right place!
  • Deborah Andrews, Professor of Design for Sustainability and Circularity, London South Bank University / CEDaCI project
  • Stefan Frenzel, Managing Director, DME
Video Slides
FTS Announcement
  • Lesya Dymyd, OCP Future Technologies Symposium Chair, OCP
Video Slides
Analog In-memory computing with multilevel memristive devices for high performance computing
  • Glenn Ge, Presenter, TetraMem Inc.
Video Slides
Delivering Performant AI Solutions
  • Alex Ramirez, Platforms Performance Engineer, Google
Video Slides
Large Memory Server Design Overview
  • Todd Rosedahl, Senior System Architect, Jabil
Video Slides
Novel Power Optimization Methods for AI/HPC Chips: Workload-Aware Adaptive Voltage Scaling
  • Andrea Matteucci, Product Manager, proteanTecs
Video Slides
FTS Wrap-up
  • Lesya Dymyd, OCP Future Technologies Symposium Chair, OCP
Video Slides

2023 OCP Future Technologies Symposium (2023 OCP Global Summit)

18 October 2023, San Jose, CA

Title Speakers
2023 FTS Welcome and Kickoff Lesya Dymyd (OCP) | Allan Smith (OCP) Video  
2023 FTI Updates: AI HW-SW Codesign, Cloud Service Model, Data Centric Computing Allan Smith (OCP FTI) | Weifeng Zhang (Lightelligence) | Sammy Nachimuthu (Intel) | Yang Seok (Samsung) Video  
FTI Announcement: Optics Introduction, CSM Transition Allan Smith (OCP) Video  
Toward scalable and reliable optical compute interconnects Alan Liu (Quintessent) Video  
Unlocking the Full Device Potentials Together - presented by Samsung Sungwook Ryu (Samsung) Video Slides
DC Sustainability: High-Heat-Flux Rack Level Direct-to-Chip Two-Phase Cooling Using Sustainable Fluids Richard Bonner (Accelsius) Video Slides
DC Sustainability: Liquid Cooling for Optical Networking Equipment Behzad Mohajer (Ciena) | Peter Ajersch Video Slides
DC Sustainability: The Circular Data Centre Compass - supporting Sustainability and Circularity in the Data Centre Industry Deborah Andrews (London South Bank University / CEDaCI project) Video Slides
Importance of a Test and Measurement Partner to Accelerate Innovation - presented by Spirent Communications Kevin Chang (Spirent Communications) Video  
Other (Server & Power): A M-CRPS compatible totem-pole bridgeless PFC with re-rush current control and extreme low iTHD Sheng-Yang Yu (Texas Instruments) Video Slides
Other (Server & Power): Active Tuning Control for Practical Implementations of Resonant Switched-Capacitor Converters Rose Abramson (UC Berkeley) | Haifah Sambo () Video Slides
Other (Server & Power): A 1200-A/48-V-to-1-V Switching Bus Converter for Next-Generation Ultra-High-Power Microprocessors Yicheng Zhu (University of California- Berkeley) | Robert Pilawa-Podgurski (UC Berkeley) Video Slides
Network: Ultra low-power, high-density parallel microLED optical links Rob Kalman (Avicena Tech) Video Slides
Network: Ultra-Dense and Ultra-Low Power 16x112-Gbps Linear-Drive Silicon Photonics for ML/AI Peter Winzer (Nubis Communications) Video Slides
Guessing at the future of Generative AI Zaid Kahn (Microsoft ) | Allan Smith (OCP) Video  
AI/HPC: BBCube 3D: Heterogeneous 3D Integration to Provide TB/s Bandwidth with Lowest Bit Access Energy for AI/HPC applications Norio Chujo (Hitachi- Ltd.) Video Slides
AI/HPC: Advanced package technologies for chiplet adoption and memory integration in HPC/AI applications Yan Li (Samsung) Video Slides
AI/HPC: The Future of AI/ML Innovation is Row-Scale Disaggregation Matthew Williams (Rockport Networks) Video Slides
ERA of Core Scaling - presented by AMD Robert Hormuth (AMD) Video Slides
Quantum: Low-Loss Connections to Optical Fibers for Quantum Photonic Integrated Circuits Ryan Vallance (Senko Advanced Components) Video Slides
Quantum: Advances in the Quantum Interconnect Technology Richard Pitwon (Resolute Photonics) Video Slides
Quantum: How to build a Quantum Data Center with Virtual Quantum Processors Karl Rabe (WoodenDataCenter) Video Slides
FTS WrapUp and FTI Breakout Kickoff Lesya Dymyd (OCP) | Allan Smith (OCP) Video  
OCP Future Technology Symposium Awards Ceremony Introduction by Andy Bechtolsheim (Arista), Presented by Lesya Dymyd (OCP) | Allan Smith (OCP) Video