The Door Heat Exchanger Sub-Project is under the direction of the OCP Cooling Environments.
Specs, standards, and products that support:
- Rack System Architectures such as the following:
- 19” EIA Compatible
- 21” Open Rack
- Rack-Level Power Systems
Conversion, Storage, and Control Systems of power between the data center infrastructure and the IT gear.
- Shelves, supports, sub-chassis, and adapters needed to implement IT gear
Regular Project Calls
Every other Thursday from 09:00-10:00am PT/18:00-19:00 CET/00:00-01:00 CST.
These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on th respective project's wiki page and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/. If you have any questions please contact OCP.