The OCP Project & Sub-Project Leads help to organize and direct various OCP projects and sub-projects. These amazing volunteer leaders are the shepherds of new contributions (specs, designs, software, systems, facilities, etc.) that are part of the OCP ecosystem. They help to drive innovation, cultivate our community and foster growth of openness and scale across projects, verticals and geographies.
Credo Semiconductor
Interconnects
Victaulic
Cooling Environments
Intel
Cooling Environments
Google
Data Center Facility
Dell Inc.
Hardware Management
Broadcom
Hardware Management
NVIDIA
Networking
Meta
Networking
Intel
Open System Firmware
Google
Open System Firmware
Meta
Rack & Power
Rittal
Rack & Power
Microsoft
Security
Google
Security
Open Compute Project
OCP Ready™ Facility Recognition Program
Dell Inc.
Server
Microsoft
Server
Western Digital
Storage
Google
Storage
Edgecore Networks
Telco
Nokia
Telco
Edgecore Networks
Device Manager - Incubation
Vertiv
Advanced Cooling Facilities
J.M. Gross Engineering
Advanced Cooling Facilities
Intel
ACS Cold Plate
Asperitas
ACS Immersion
Green Revolution Cooling
ACS Immersion
Microsoft
Hardware Fault Management - Incubation
Flex
Edge
Nokia
Edge
Open Compute Project
Enterprise Connectivity Solutions (ECS) - Incubation
Alfa Laval
Heat Reuse - Incubation
Cloud & Heat Technologies
Heat Reuse - Incubation
Meta
Mezz (NIC)
Distech Controls
OCP Ready™ Facility Recognition Program
Amazon
Open Network Linux (ONL)
Broadcom
Open Domain-Specific Architecture
Open Compute Project
High Performance Computing - Incubation
Cupertino Electric Inc.
Modular Data Center
Open Compute Project
Modular Data Center
NVIDIA
ONIE
Inspur
OpenRMC
Samsung Electronics
Regional Project Community - Korea
Open Compute Project
Future Technologies Initiative
Jordan is a Thermal/Mechanical Engineer on the Datacenter Thermal-Mechanical Solutions team at Intel, specifically working in Intel's mechanical and liquid-cooling testing lab. He began his involvement with OCP in 2018 as the lead test engineer for hand-mate Universal Quick Disconnect (UQD) inter-supplier testing. Since then, he has contributed to multiple OCP specifications and whitepapers with the goal of aiding the datacenter industry transition to cold-plate liquid-cooling.
