Marketplace Listings

Browse and search the OCP Marketplace — hardware, solutions, and facilities from the OCP community and its providers.
Exhibitors demonstrating hardware to a visitor on the expo floor at the 2025 OCP Global Summit

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  1. NetSPI+Synack

    NetSPI+Synack is a leader in offensive security, combining elite human expertise with agentic AI to help organizations identify, validate, prioritize, and remediate exploitable risk across their entire attack surface. Its platform delivers expert-validated testing in depth,…

  2. Samsung Foundry’s Advanced Packaging for High-Performance Chiplet Integration

    Advanced packaging is essential to unlocking the performance and scalability of next-generation chiplet architectures. Samsung Foundry’s comprehensive portfolio of 2.xD and 3D packaging technologies enables the heterogeneous integration of multiple dies with specialized functions to work…

  3. Supermicro MGX 1.2 Rack

    Supermicro offers a number of MGX 1.2 Racks in different sizes and colors Product(s):SRK-52MGSM-7512050-B1 (Black)SRK-52MGSM-7512050-W1 (White)SRK-52MGSM-6012050-B1 (Black)SRK-52MGSM-6012050-W1 (White) SRK-48MGSM-7512050-B1 (Black)SRK-48MGSM-7512050-W1 (White)SRK-48MGSM-6012050-B2 (Black)SRK-48MGSM-6012050-W1 (White)

  4. CPI’s OCP Open Rack V3 (ORV3)

    CPI’s ORV3 provides an open, scalable platform for high-density compute and AI infrastructure based on the Open Rack V3 architecture. Designed to support 21-inch Open Rack or 19-inch EIA IT equipment, power shelves, and high-amperage busbar…

  5. EISELE Universal Quick Disconnect (UQD) Couplings

    EISELE UQD dry-break couplings provide leak-free, secure and flow-optimized connections for high-performance liquid cooling systems. Combined with EISELE’s unique THERMOLINE hose connection concept, they enable fast, secure and clamp-free installation of multilayer hoses without special tools.EISELE…

  6. Flex Secure Control Module SCM203A – DC-SCM 2.2 Type 1 Compact

    The Flex SCM203A is a Compact Form Factor (CFF) secure control module built to the OCP DC-SCM 2.2 specification. Server designers get full BMC functionality without giving up valuable board space. It runs on Aspeed’s AST2700…

  7. Modular Rear Door Heat Exchanger

    The KühlTherm Modular Rear Door Heat Exchanger (RDHx) is a rack-mounted liquid-to-air cooling unit that attaches to the rear of a server rack. It removes heat from server exhaust air before that air reaches the room.…

  8. Gates® Universal Quick Disconnect (UQD) Couplings

    Gates® Universal Quick Disconnect (UQD) Couplings deliver the uncompromising performance your critical infrastructure requires. With maximum flow, reliable sealing, and compatibility with Gates® Data Master™ and other data center cooling hoses, ensure the right configuration every…

  9. Alfa Laval Brazed Plate Heat Exchanger – Model CB40

    INTRODUCTIONThe Alfa Laval CB40 copper brazed plate heat exchanger (BHE) is engineered to provide efficient heat transfer with a compact footprint. The brazing material seals and holds the plates together at the contact points ensuring optimal…

  10. EMCOR Open Rack Wide (ORW)

    The EMCOR Open Rack Wide (ORW) META Rack is a large-format, high-capacity rack platform engineered for the evolving requirements of next-generation AI and high-density computing environments. Its 1200mm wide by 1219mm deep frame provides increased equipment…

  11. CoreVault™ Cold Aisle Component Cases

    CoreVault™ Cold Aisle Rack Infrastructure Packaging Solutions: Robust, reusable containers engineered for the front-of-rack hardware. These custom-designed packaging systems enable rapid in-aisle swaps, keep GPUs, switches, CDUs, and other mission-critical OEM components safe in transport, storage,…

  12. OCP – Deschutes 5 In-Row CDU

    The OCP – Deschutes 5 CDU is a next-generation, high-capacity liquid-cooling distribution unit defined by Google and contributed to the Open Compute Project (OCP) to accelerate industry-wide adoption of liquid cooling at scale.Designed for AI/ML and…