The Modular Data Center Sub-Project is under the direction of the OCP Data Center Facilities Project Group.
The Modular Data Center Sub-Project collaborates on design and uses of modular solutions optimized for OCP hardware. The advantages that OCP hardware provides in maintainability and scalability is magnified in the modular environment. Participants of the MDC sub-project develop solutions that enable OCP hardware use in power, cooling, IT, and all-in-one modules.
Primary interests in the Modular Data Center Sub-Project include; improving the speed of data center deployment, reducing the environmental impact in data center construction, and improving data center efficiency in both power and cooling. One of the main contributions from the MDC Sub-Project is to simplify the use of OCP hardware for customers outside the Hyperscale sector by sizing down the formfactor for Data Centers and creating scalability systems for the infrastructure.
Regular Project Calls
This sub-project meets on the first Wednesday of every month at 9:30 CDT (3:30 BST) except on DCF Project meeting dates