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Presented by OPC & JEDEC

Register for the second part of the Joint OCP & JEDEC Workshop - Standards for Chiplet Design with 3DIC Packaging

This workshop will bring together chip designers, chiplet providers, EDA tool providers, packaging and test houses and foundry partners to discuss developing common data formats, tool interfaces and process flows for a revamped supply chain.

The goal of the workshop is to identify standards that, if developed, can simplify chiplet/3DIC design from specification and tapeout to chip packaging. We envision that interoperable formats will streamline handoffs between design, verification, assembly and packaging tools. Standardized workflows will also facilitate collaboration across organizational boundaries.

Part One can be found here

Part Two:

Date: Jun 21, 2024

Time: 08:00 AM Pacific Time
(US and Canada)

Duration: 2 Hours 30 Minutes

Register Today!

Organization Speaker
OCP (ADK/MDK) James Wong, OCP CDX Co-Lead
Intel Lalitha Immaneni, VP, Architecture, Design and Technology Advanced Packaging
Anemoi Software     David Ratchkov, CEO and Founder, OCP CDX Co-Lead
Synopsys Aparna Tarde, Technical Marketing Manager
ARM Dominic Brown, Senior Prinicipal Engineer
Fermilab Farah Fahim, Division Director, Microelectronics
Microchip Anu Ramamurthy, Associate Fellow, Design
UCLA Puneet Gupta, Professor, Electrical and Computer Engineering
Alphawave Semi Sue Hung Fung, Product Marketing Manager
Si2 Marc Rose, Executive Technical Assistant
Blue Cheetah Elad Alon, CEO and Co-founder
OCP James Wong, OCP CDX Co-Lead

#61DAC

DAC 2024

Date(s): June 23-27

Location: Moscone West, San Francisco

DAC is recognized as the global event for chips to systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (SIGDA) and IEEE's Council on Electronic Design Automation (CEDA).

OCP's Chief Innovation Officer, Cliff Grossner will be moderating a panel session on The Open Chiplet Economy and AI with participation from Palo Alto Electron, Blue Cheeta Analogue, Alphawave, Lawerence Berkeley National Lab, Xscape Communications, and ASE between 10:30am - 12:00pm Pacific Time.

Register Today!


2024 OCP China Day

Date: August 8, 2024 in Beijing, China

Download OCP China Day Sponsorship Opportunities

Those interested in sponsorship should contact events@opencompute.org.

Registration is now open! Register here: https://www.bagevent.com/event/registerTicket/8826835


2024 OCP APAC Summit

Dates: September 3 - 4, 2024 in Suwon, South Korea

Regional open-source communities will gather at the Suwon Convention Center in South Korea for a community-powered open-source community event! The OCP APAC Summit is being co-located with the OpenInfra Summit Asia to bring two premier open-source software and hardware infrastructure events together!

We have opened up sponsor and exhibit opportunities. If you have interest and would like to learn more simply send an email to sponsor@opencompute.org

Learn more about sponsorships

You're invited to present at the 2024 OCP APAC Summit, the premier open source hardware, firmware and system management event where experts discuss redesigning computational infrastructure to efficiently support the growing demands of High Performance Computing and AI.

Your experiences, success stories, and insights into open infrastructure & open hardware topics are invaluable to us. Join us and help pave the way for the future of open source infrastructure worldwide!

All sessions will be 30 minutes

The Call for Presentations is OPEN until 21 JUNE for the following topics:

Session Topics:

  • CXL: Establishing and Managing large Memory Pools for HPC and AI
  • Storage: Standardization, chassis and sleds, components and peripherals, networked enabled storage and compatibility solutions
  • Servers: Modularity supporting Computation from Data Center to the Edge
  • Networking/Interconnect: Front-end and back-end Fabrics needed for AI and HPC
  • Cooling: Keeping the 100-200+ MW Rack Cool
  • AI: From Algorithms and Orchestrating Workloads to Hardware Innovations
  • Sustainability: Creating Green Hardware-Aware Software on Scalable Computational Infrastructure
  • Security: Securing the hardware (hardware embedded root of trust) and software stack with (Firmware BOM and Software BOM)
  • Software-Defined Storage:  Software-defined storage architecture design, large scale system design, cloud computing IaaS/PaaS system design
  • Other: Have something that doesn’t fit within these categories? Share your open hardware sessions here

Submissions may be submitted in either English or Korean. The breakout rooms will be equipped with real-time translation tools.

Deadline for submissions is June 21, 2024.

Learn more and Submit a talk


AI Hardware & Edge AI Summit

Dates: 9-12 September, 2024

Location: Signia by Hilton, San Jose, CA

OCP will be hosting a panel discussion on September 12 on Current Net Zero Commitments and Data Center Growth Compatibility. 

Learn more and register here and receive 15% off with code OCP15.

 


Data Center Anti Conference | DCAC

Dates: September 24 - 25, 2024

Location: Austin, TX | ACL Live at Moody Theater

Now entering its eighth year and expanding to a two-day summit, DCAC is disrupting the traditional conference model to focus on the emerging technologies driving compute demand.

With AI, autonomous vehicles, IoT, immersive gaming, VR/AR, smart city technologies, and wearables on the horizon, we are on the cusp of a societal and economic transformation. And at the heart of this transformation are data centers. Effective leadership is crucial for any revolution, and DCAC is inviting you to join us as we journey back to the future of the data center.

View the Event's details


YOTTA 2024

YOTTA

Date(s): October 7-9, 2024

Location: Las Vegas, NV

Introducing Yotta 2024, a full-stack, large-scale industry event that elevates the digital infrastructure conversation onto the main stage and takes on the fundamental questions facing the industry. Yotta brings together the digital infrastructure ecosystem - hyperscalers, colos, telcos, network, compute, storage, enterprise IT, investors, startups and more - to debate the pressing questions facing all.

View the Event's details

Use Discount Code "OCP" for 20% off!


OCP Global SUMMIT

2024 OCP Global Summit

October 15-17, 2024: San Jose, CA

View the Event's details


SC24

SC24

Date(s): November 18-21, 2024

Location: Atlanta, GA

The International Conference for High Performance Computing, Networking, Storage, and Analysis

Visit the Event's Website


OFC (Optical Fiber Conference)

April 1-3, 2025: San Francisco CA, (Moscone Center)


2025 OCP EMEA Summit

April 29-30, 2025: Dublin, Ireland


2025 OCP Global Summit

October 14-16, 2025: San Jose, CA


2026 OCP Global Summit

October 13-15, 2026: San Jose, CA


2027 OCP Global Summit

October 12-14, 2027: San Jose, CA


OCP Events Calendar