Contact Career Center
Open Compute Project®
  • About
    • History & Mission
    • Foundation Staff
    • Board
    • Incubation Committee
    • Project Leads
    • Media and Press Guidelines
    • OCP Policies
    • OCP Adoption
  • Marketplace
    • Integrated Solutions
    • Facilities & Services
    • Telecom & Edge
    • Products
  • Solution Providers
    • Solution Provider Programs & Fees
    • Solution Provider Agreements
    • Solution Providers Directory
    • How to Become a Solution Provider
    • Product Recognition Program
    • Facility Recognition Program
    • SP Portal
  • Contributions
    • Contributions Database
    • How to Contribute
    • Contribution Agreements
    • Contributor Portal
  • Projects
    • Overview
    • Project & IC Meetings Calendar
    • Cooling Environments
      • Cold Plate
      • Advanced Cooling Facilities
      • Heat Reuse
      • Door Heat Exchanger
      • Immersion
    • Data Center Facility
      • DCF Sustainability
      • Modular Data Center
      • Operation Technology Security
      • OCP Ready™ Facility Recognition Program
    • Hardware Management
      • OpenRMC-DM
      • Hardware Fault Management - Incubation
      • Hardware Management Module
    • Networking
      • Enterprise Connectivity Solutions (ECS)
      • Open Network Linux (ONL)
      • Interconnects
      • ONIE
      • SAI
      • SONiC
    • Open System Firmware
    • Rack & Power
    • Security
    • Server
      • Composable Memory System
      • DC-MHS
      • High Performance Computing - Incubation
      • NIC
      • Open Accelerator Infrastructure
      • Open Domain-Specific Architecture
    • Storage
    • Sustainability
    • Telco
      • Edge
    • Time Appliances Project (TAP)
    • OCP Strategic Initiatives
      • Test and Validation Enablement Initiative
    • Future Technologies Initiative
      • AI HW SW CoDesign Workstream
      • Cloud Service Model Workstream
      • Computational Storage
    • Regional Project Community - APAC
    • Regional Project Community - China Mainland
    • Regional Project Community - Europe
    • Regional Project Community - Japan
    • Regional Project Community - Korea
    • Regional Project Community - Taiwan
  • Events
    • OCP Global Summit
    • OCP Regional Summit
    • OCP Future Technologies Symposium
    • OCP Educational Webinar Program
    • Participating in the New Open Chiplet Economy
    • Upcoming Events
    • Past Events
  • Membership
    • Overview & Fees
    • Membership Directory
    • How to Join
    • Membership Agreements
  • Blog
  • About
    • History & Mission
    • Foundation Staff
    • Board
    • Incubation Committee
    • Project Leads
    • Media and Press Guidelines
    • OCP Policies
    • OCP Adoption
  • Marketplace
    • Integrated Solutions
    • Facilities & Services
    • Telecom & Edge
    • Products
  • Solution Providers
    • Solution Provider Programs & Fees
    • Solution Provider Agreements
    • Solution Providers Directory
    • How to Become a Solution Provider
    • Product Recognition Program
    • Facility Recognition Program
    • SP Portal
  • Contributions
    • Contributions Database
    • How to Contribute
    • Contribution Agreements
    • Contributor Portal
  • Projects
    • Overview
    • Project & IC Meetings Calendar
    • Cooling Environments
      • Cold Plate
      • Advanced Cooling Facilities
      • Heat Reuse
      • Door Heat Exchanger
      • Immersion
    • Data Center Facility
      • DCF Sustainability
      • Modular Data Center
      • Operation Technology Security
      • OCP Ready™ Facility Recognition Program
    • Hardware Management
      • OpenRMC-DM
      • Hardware Fault Management - Incubation
      • Hardware Management Module
    • Networking
      • Enterprise Connectivity Solutions (ECS)
      • Open Network Linux (ONL)
      • Interconnects
      • ONIE
      • SAI
      • SONiC
    • Open System Firmware
    • Rack & Power
    • Security
    • Server
      • Composable Memory System
      • DC-MHS
      • High Performance Computing - Incubation
      • NIC
      • Open Accelerator Infrastructure
      • Open Domain-Specific Architecture
    • Storage
    • Sustainability
    • Telco
      • Edge
    • Time Appliances Project (TAP)
    • OCP Strategic Initiatives
      • Test and Validation Enablement Initiative
    • Future Technologies Initiative
      • AI HW SW CoDesign Workstream
      • Cloud Service Model Workstream
      • Computational Storage
    • Regional Project Community - APAC
    • Regional Project Community - China Mainland
    • Regional Project Community - Europe
    • Regional Project Community - Japan
    • Regional Project Community - Korea
    • Regional Project Community - Taiwan
  • Events
    • OCP Global Summit
    • OCP Regional Summit
    • OCP Future Technologies Symposium
    • OCP Educational Webinar Program
    • Participating in the New Open Chiplet Economy
    • Upcoming Events
    • Past Events
  • Membership
    • Overview & Fees
    • Membership Directory
    • How to Join
    • Membership Agreements
  • Blog
  • Contact
  • Career Center

Blog

  1. Blog
  2. Articles by Bill Carter, OCP Fellow Emeritus

What to Expect: 2022 OCP Global Summit Keynotes!

Thursday, September 22, 2022 · Posted by Bill Carter, OCP Fellow Emeritus

The insights contained in Gordon Moore's now famous 1965 and 1975 papers have accurately described how semiconductor technology scaled performance to meet the fast paced demand for compute resources.  For most of 40 years, Moore’s law was both an accurate predictor of the pace of inno (...)

Continue reading
About
  • History & Mission
  • Foundation Staff
  • Board
  • Incubation Committee
  • Project Leads
  • Media and Press Guidelines
  • OCP Policies
  • OCP Adoption
Marketplace
  • Integrated Solutions
  • Facilities & Services
  • Telecom & Edge
  • Products
Solution Providers
  • Solution Provider Programs & Fees
  • Solution Provider Agreements
  • Solution Providers Directory
  • How to Become a Solution Provider
  • Product Recognition Program
  • Facility Recognition Program
  • SP Portal
Projects
  • Overview
  • Cooling Environments
  • Data Center Facility
  • Hardware Management
  • Networking
  • Open System Firmware
  • Rack & Power
  • Security
  • Server
  • Storage
  • Sustainability
  • Telco
  • Time Appliances Project (TAP)
  • OCP Strategic Initiatives
  • Future Technologies Initiative
  • Regional Project Community - APAC
  • Regional Project Community - China Mainland
  • Regional Project Community - Europe
  • Regional Project Community - Japan
  • Regional Project Community - Korea
  • Regional Project Community - Taiwan
Events
  • OCP Global Summit
  • OCP Regional Summit
  • OCP Future Technologies Symposium
  • OCP Educational Webinar Program
  • Participating in the New Open Chiplet Economy
  • Upcoming Events
  • Past Events
Membership
  • Overview & Fees
  • Membership Directory
  • How to Join
  • Membership Agreements
Blog

The Open Compute Project was first released by Facebook in 2011.

  • Privacy Policy
  • Terms of Service
  • OCP Policies

Thanks to Rackspace for hosting. Site by White Lion.