Direct-to-Chip Liquid Cooling for the AI Data Center

  ACCELSIUS   Danfoss   Dell'Oro Group  

Date: Thursday, May 16, 2024

Time: 10:00 AM Eastern Daylight Time

Duration: 1 hour


Data center sustainability and efficiency are related goals being rapidly cast into the spotlight by exponential growth in AI and high-performance computing. Data centers today are estimated to constitute nearly 2% of global energy consumption. With a strong pipeline of industry growth, set against power availability challenges, data centers need to operate more efficiently. Since thermal management can consume up to 40% of a data center’s electrical use, there are significant opportunities for data centers to improve their thermal operations, and prepare for AI capable hardware. Direct-to-chip single and two-phase liquid cooling technologies are enabling efficiency gains through retrofits of existing data centers and greenfield deployments alike. Finally, thermal management impacts sustainability beyond energy consumption, opening the door to reduce water usage and enable heat reuse. This webinar will help educate the data center ecosystem on the state of single and two-phase direct-to-chip cooling, the regulatory environment, and its potential benefits for sustainable data center thermal management.

During the webinar, you’ll learn:

  • Provide an overview and pros and cons for various liquid cooling solutions
  • Understand the benefits, challenges and planning requirements for next generation two-phase direct-to-chip liquid cooling technologies
  • Advancements, drawbacks, and evolutions of single and two-phase dielectric cooling fluids
  • Highlight successful data center use cases for optimizing efficiency with two-phase direct-to-chip cooling solutions

Who should attend?

Data Center Physical Infrastructure Vendors, Silicon Vendors, Colocation, Cloud and Telecom Service Providers, IT buyers and Decision Makers, and Enterprise CIO and CTO

Register Today!


Cliff Grossner Chief Innovation Officer, Open Compute Project (OCP)Cliff Grossner

Chief Innovation Officer, Open Compute Project (OCP)

At the Open Compute Project Foundation, Dr. Grossner leads its market intelligence function and is responsible for driving new innovation programs including guiding inventors developing their early-stage company ideas, setting strategic direction and building awareness of OCP, establishing new alliances, and launching new activities in OCP’s Future Technologies Initiative. Cliff has more than 25 years of telecommunications industry experience encompassing scientific research, market analysis, corporate and product strategy, product management and marketing. Previously, Dr. Grossner was head of the Cloud and Data Center Research Practice, which he launched at Infonetics research and followed through transitions to IHS, IHS Markit and Informa Group. Prior to Infonetics, he held senior positions, including heading strategic marketing for Alcatel-Lucent's enterprise network business, tenures at Bell Labs, several startups and Nortel. He earned his Ph.D. at McGill University, and his Master of Science in Computer Science at Concordia University, winning national scholarships to support his graduate work. He holds more than 10 patents in computer networking, networking embedded security and telecommunications applications.

Lucas Beran Research Director, Dell'Oro GroupLucas Beran

Research Director, Dell'Oro Group

Lucas Beran joined Dell'Oro Group in 2021 and is responsible for coverage of Data Center Physical Infrastructure. Mr. Beran’s research and analysis have been widely cited in leading trade and business publications. Mr. Beran is a frequent speaker at industry conferences and events. Mr. Beran graduated cum laude with a B.A. in Economics and Applied Mathematics minor from the Honors College of Boise State University.

Richard Bonner Chief Technology Officer, AccelsiusBrandon Marshall

Chief Technology Officer, Accelsius

Dr. Bonner is a distinguished heat transfer researcher with 18 years in thermal product development, specializing in two-phase cooling. He's authored over 50 papers and holds 5 U.S. patents, having designed cooling products for 125+ clients in various sectors. He's a former AIChE Transport and Energy Processes Division Director and holds a B.S., M.S., and Ph.D. in Chemical Engineering from Lehigh University.

Amanda Bryant Product Manager, DanfossAmanda Bryant

Product Manager, Danfoss

Amanda Bryant has been directly involved in data center liquid cooling throughout her 8 years of experience at Danfoss, starting her career in Applications Engineer and now in Product Management. Amanda works to address the escalating demands for higher compute capabilities dedicating time to the fluid conveyance system solutions for data center cooling. Amanda holds a Bachelor of Science in Mechanical Engineering from Ohio Northern University.