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| Presenters (Company) | Title | Slides |
| John Stuewe (Dell) Mark Shaw (Microsoft): Server Project Co-leads |
- Mission and importance - Sub Projects - Workstreams |
Slides |
| Damien Chong (Meta): Mezz Sub-Project Lead Jason Rock (Dell) |
- OCP NIC 3.0 sub-project updates. - Plans for PCIe Gen6 and sidebands - OCP NIC Gen5 test fixtures |
Slides |
| Song Kok Hang(Intel) Bichen Chen (Meta) John Norton (Nvidia) Peter Chen (Enflame) |
- OAI High speed and system workstream update - Nvidia contributing HGX physical spec to OAI - Successful story from Enflame with OAI - First liquid-cooled OAI/OAM system in production |
|
| Allan Cante (NallasWay): HPC Sub-Project Lead | HPC sub-project update progress and projects with a request for additional participation | Slides |
| Bapi Vinnakota (Broadcom): ODSA Sub-Project Lead |
ODSA sub-project update |
Slides |
| Ketan Mehta (SiFive) Rishi Chugh (Cadence) |
ODSA sub-project: OpenHBI Products - OHBI PHY w/ Link Controller for OHBI/BoW - UltraLink and HBI PHY |
|
| Elad Alon (Blue Cheetah Analog) Kash Johal (eTopus) |
ODSA sub-project: BoW Products - BoW PHY's - I/O chiplets with BOW PHY |
|
| Gary Miller (NXP) Jayaprakash Balachandran (Cisco) |
ODSA sub-project: Prototypes - NXP activities - BoW PHY Interoperability Test Package |
|
|
Brian Faith (Quicklogic) |
ODSA sub-project: IP and ASIC Products - I/O Chiplets - 400G SmartNIC Chiplets / BoW - 4th Generation SmartNic Using Chiplets and Die to Die Interconnect - Chiplet based AI Compute Platform using BOW PHY/Controller |
|
| John Stuewe (Dell) Mark Shaw (Microsoft): Server Project Co-leads |
Wrap up and next steps: - What can the Server Project do better? - Which communities should we collaborate with? - What areas should we focus on? |