OCP Educational Webinar: Liquid Cooling TCO Comparison for the AI Data Center

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Liquid Cooling TCO Comparison for the AI Data Center

  Dell'Oro Group   Chemours   Liquid Stack   Syska Hennessy Group  

Description:

Accelerated computing, AI, ML and high-performance computing (HPC) demand is skyrocketing, driving needs for liquid cooling. Customers are currently facing important decisions on developing new cooling strategies to enable higher rack power densities, with 100kW+ racks being considered by hyperscale data center operators. Liquid cooling helps solve the current challenges of performance, efficiency and space utilization associated with air cooling. Liquid cooling adoption has several key tradeoffs (including overall performance, capex, opex, floorspace, and water consumption) between single or two phase cooling technologies, and direct to chip or immersion. Since accelerated computing is a spectrum, requiring a variety of hardware depending upon use case (training vs inference), necessitating a cooling strategy that can accommodate these differences is critical. Safety and sustainability, particularly for new fluids, are also factors that need to be considered when developing a liquid cooling strategy.

This webinar will discuss three different liquid cooling alternatives (Single phase immersion, two phase immersion, and water-based direct to chip), covering data center use cases explaining the advantages of each, helping buyers determine which technology might be right for them.

During the webinar, you’ll learn:

  • The differences and advantages of Single or Two Phase, Direct to Chip or Immersion Cooling
  • How the CapEx and OpEx compares for each technology in various scenarios and rack densities
  • Tradeoffs for liquid cooling technologies: equipment cost comparison, floorspace savings, free cooling potential, etc.
  • The model used for each scenario: an understanding of inputs and calculations involved
  • Revised adoption timelines of different liquid cooling technologies

Who should attend?

Data Center Infrastructure Vendors, Silicon Vendors, Colocation Facilities providers, Cloud and Telecom Service Providers, IT buyers and Decision Makers, and Enterprise CIO and CTO

Meet the Speakers

Cliff Grossner Chief Innovation Officer, Open Compute Project (OCP)Cliff Grossner

Chief Innovation Officer, Open Compute Project (OCP)

At the Open Compute Project Foundation, Dr. Grossner leads its market intelligence function and is responsible for driving new innovation programs including guiding inventors developing their early-stage company ideas, setting strategic direction and building awareness of OCP, establishing new alliances, and launching new activities in OCP’s Future Technologies Initiative. Cliff has more than 25 years of telecommunications industry experience encompassing scientific research, market analysis, corporate and product strategy, product management and marketing. Previously, Dr. Grossner was head of the Cloud and Data Center Research Practice, which he launched at Infonetics research and followed through transitions to IHS, IHS Markit and Informa Group. Prior to Infonetics, he held senior positions, including heading strategic marketing for Alcatel-Lucent's enterprise network business, tenures at Bell Labs, several startups and Nortel. He earned his Ph.D. at McGill University, and his Master of Science in Computer Science at Concordia University, winning national scholarships to support his graduate work. He holds more than 10 patents in computer networking, networking embedded security and telecommunications applications.


Lucas Beran Research Director, Dell'Oro GroupLucas Beran

Research Director, Dell'Oro Group

Lucas Beran joined Dell'Oro Group in 2021 and is responsible for coverage of Data Center Physical Infrastructure. Mr. Beran’s research and analysis have been widely cited in leading trade and business publications. Mr. Beran is a frequent speaker at industry conferences and events. Mr. Beran graduated cum laude with a B.A. in Economics and Applied Mathematics minor from the Honors College of Boise State University.


Brandon Marshall Global Marketing Manager - Automotive & Immersion Cooling, The Chemours CompanyBrandon Marshall

Global Marketing Manager - Automotive & Immersion Cooling, The Chemours Company

Brandon has over 16 years of experience in the HVAC and Refrigeration industry serving in a variety of roles including contracting, engineering, and technical marketing. Brandon is passionate about supporting the industry in navigating the complex technological and regulatory landscape of today’s market to further institute the use of new technologies that achieve a reduced impact on the environment and customer’s bottom line. Brandon currently holds a Bachelor of Science in HVACR Design Technology from Pennsylvania College of Technology and a Master of Business Administration (MBA) from the John E. Simon School of Business at Maryville University.


Gustavo Pottker Senior Principal Engineer, Thermal and Specialized Solutions, The Chemours CompanyGustavo Pottker

Senior Principal Engineer, Thermal and Specialized Solutions, The Chemours Company

Gustavo Pottker has combined more than 20 years of industry and academic experience in the HVAC, Refrigeration, Thermal Management areas, including a variety of R&D roles in fluorochemical companies. He is the author of dozens of patents, conference, and journal publications. Gustavo holds a PhD in Mechanical Engineering from the University of Illinois at Urbana-Champaign. His current role is focused on developing heat transfer fluids for thermal management applications including immersion cooling.


Nick Schweissguth Director of Product Development, LiquidStackNick Schweissguth

Director of Product Development, LiquidStack

Nick has over 10 years of experience in the data center industry. He has worked with advanced liquid cooling systems, micro data centers, and mission critical infrastructure for some of the largest tech companies in the world, including LiquidStack, Eaton, APC by Schneider Electric, and Parker Hannifin. Nick is passionate about advancing liquid cooling technology to enable the development of ultra-high flux CPUs and GPUs that can support advanced cloud services, AI, and ML.


Todd Czworniak PE, LEED AP, Syska Hennessy GroupTodd Czworniak

PE, LEED AP, Syska Hennessy Group

Todd Czworniak is a highly experienced Professional Engineer, LEED Accredited Professional, and Uptime Institute Accredited Tier Designer with a specialization in designing mechanical systems for mission-critical facilities. With over 18 years of expertise, he has played a pivotal role as a supervising engineer in the design of mechanical systems for hyperscale, colocation, and enterprise data centers. In his capacity as a lead mechanical engineer, Todd meticulously examines the requirements of each project, including program specifications, schedules, and budgets. He actively collaborates with clients in the mission-critical facility sector to enhance reliability and seamlessly integrate new technologies into their operations. Todd's extensive design portfolio encompasses a wide range of systems, including direct evaporative cooling systems, central air- and water-cooled chilled water plants, liquid-to-chip and immersion cooling, as well as air distribution equipment and various energy recovery systems. He has also spearheaded major infrastructure renovations for critical facilities, conducted site assessments, and contributed to site selection projects. With a degree in Mechanical Engineering from Bradley University, Todd is deeply committed to professional development and is an active member of prestigious organizations such as the U.S. Green Building Council (USGBC) and the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE). His dedication to advancing sustainable and efficient design practices underscores his commitment to excellence in the field of mechanical engineering for mission-critical facilities.