Server

The OCP Server Project provides standardized server system specifications for scale computing. Standardization keeps the OCP specification pool from fragmenting into point solutions, and the project works with the other OCP disciplines to ensure broad adoption and optimization across validation, manufacturing, deployment, data center operations, and de-commissioning. Its scope covers Open Rack and Open CloudServer compatible chassis, sleds, and blades; micro-servers; EIA 310-D/E 19-inch rack derivative chassis and sleds; components and peripherals such as riser cards, mezzanine I/O, accelerators, and networking; and specification standards for interfaces, manageability, debug, and test.

Server

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Steering Committee Representative

Gregory D Sellman

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About This Project

The OCP Server Project provides standardized server system specifications for scale computing. Standardization is key to ensuring that the OCP specification pool does not get fragmented by the point solutions that plague the industry today.

The Server Project collaborates with the other OCP disciplines to ensure broad adoption and achieve optimizations throughout all aspects — from validation to manufacturing, deployment, data center operations, and de-commissioning.

Scope

The Server Project’s scope covers:

  • Open Rack compatible chassis and sleds
  • Open CloudServer compatible chassis and blades
  • Micro-servers : chassis and carriers, including ARM and x86
  • EIA 310-D/E 19” rack derivative chassis and sleds : using Open Rack motherboards
  • Components and peripherals : riser cards, mezzanine I/O, accelerators, networking
  • Specification standards : electrical interfaces, mechanical interfaces, manageability, debug & test framework

Resources

This Project is open to the public and we welcome all those who would like to be involved.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP’s Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

The OCP Server Project provides standardized server system specifications for scale computing. Standardization is key to ensure that OCP specification pool does not get fragmented by point solutions that plague the industry today. The Server Project collaborates with the other OCP disciplines to ensure broad adoption and achieve optimizations throughout all aspects from validation, to manufacturing, deployments, data center operations, and de-commissioning.

The Scope of the OCP Server Project is described in the Charter

Wikis

Contributions, Specs, and Designs that are being actively worked are in the Working Wiki at:

Previous contributions and specs that have already been accepted are at:

Sub-Projects

Sub-Projects are focused discussions on specific topics that have their own meetings and Wikis.

Workstreams and Special Projects

Workstreams Sub-Projects are focused discussions on specific topics with smaller scale and timeframe than full sub-projects

Retired Sub-Projects

OCP Marketplace

Presentation Template

  • OCP Presentation Template – please contact Michael Schill for a copy

Regular Project Calls

This project meets once a month via a conference call the fourth Wednesday of the month at 8AM-PT / 10AM-CT / 11am-ET / midnight-China(winter) / 11pm-China(summer) please check the call calendar for any updates.

  • Zoom Call Link Phone one-tap: US: [tel:+13052241968,,86922295427# +13052241968,,86922295427#] or [tel:+13092053325,,86922295427# +13092053325,,86922295427#]
  • Agendas will be sent out to the Mailing List before each meeting

Call Calendar

These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project’s wiki page and are open to the public in accordance to OCP’s Bylaws and IP Policy. This can be found at http://www.opencompute.org/about/ocp-policies/. If you have any questions please contact OCP.

Server calendar

Related Details

Contributions

All project contributions

Sub-Projects

AI Hardware Software Co-Design

AI HW SW CoDesign is a Sub-Project of the OCP Server Project. Because AI innovation is often constrained by compute platforms with long design cycles, the workgroup aims to enable a scalable yet composable infrastructure that adapts dynamically to an application's runtime characteristics. Its 2023 whitepaper, Polymorphic Architecture for Future AI Applications, proposed hardware-software co-design with large-scope scalability and hierarchical transformability and composability; a newer whitepaper details the Polymorphic Architecture around continuous transformability and recursive composability, letting resources from chiplets to data centers reconfigure for diverse workloads. Current study areas include seamless scaling across hierarchies, HW/SW co-design for utilization and energy efficiency, flexible configuration, heterogeneous resources and cost savings.

Composable Memory System

Composable Memory System (CMS) is a Sub-Project under the OCP Server Project. It was created when the OCP Future Technologies Initiative's Software Defined Memory workstream transitioned into a new OCP Sub-Project, now called Composable Memory Systems. Details about the Sub-Project's mission, leadership, scope and ways to get involved will be added in the near future.

Core

Core is a Workstream under the OCP Server Project, which provides standardized server system specifications for scale computing. Its work relates to the Modular Hardware System (MHS), which envisions interoperability between key elements of data center, edge, and enterprise infrastructure through consistent interfaces and form factors among modular building blocks. Details about the workstream’s mission, scope, deliverables, and ways to get involved will be added in the near future.

Data Center Secure Container Module

The Data Center Secure Control Module (DC-SCM) Sub-Project of the OCP Server Project creates designs and specifications that enable interoperable hardware for platform security and manageability in the form of a standardized DC-SCM module. The specification separates common platform management and security hardware and places it behind a connector specified by its pin-out, the Datacenter Secure Control Interface (DC-SCI). Deliverables include the DC-SCI specification, electrical, mechanical, functional, and logical requirements for platform designers, and design specifications for interoperable DC-SCM and HPM modules. The current published specification is DC-SCM Rev 2.2.

Data Center Secure Container Module 3

Data Center Secure Control Module 3 (DC-SCM 3.0) is a Sub-Project under the OCP Server Project, carrying forward the DC-SCM work on interoperable hardware for platform security and manageability. The DC-SCM specification separates common platform management and security hardware and places it behind a connector specified by its pin-out, the Datacenter Secure Control Interface (DC-SCI). Details about the sub-project’s mission, scope, deliverables, and ways to get involved will be added in the near future.

High Performance Computing

High Performance Computing is a Sub-Project of the OCP Server Project serving the HPC, supercomputing and high performance data analytics markets with open hardware platforms from system level down to silicon. It focuses on modular, flexible and composable heterogeneous multi-processor systems that scale to thousands of processors energy-efficiently, with data centricity measured by the Flops : Bytes/s : Bytes Depth ratio and success judged by an Application Performance Density Metric. Work proceeds in three phases - metrics, white-paper concepts, demonstrator prototypes - stays within the rack, coordinates with Rack & Power, and emphasizes HPC in the cloud. Workstreams cover interconnect, system management, thermal management and emulation FPGA module design.

Mech

Mech is a Workstream under the Data Center Secure Control Module (DC-SCM) Sub-Project of the OCP Server Project. The DC-SCM specification separates common platform management and security hardware and places it behind a connector specified by its pin-out, the Datacenter Secure Control Interface (DC-SCI). Details about the workstream’s mission, scope, deliverables, and ways to get involved will be added in the near future.

Modular Hardware System

The Modular Hardware System (MHS) Subproject envisions interoperability between key elements of data center, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

Network Interface Card / Mezz

The Network Interface Card (NIC) Sub-Project of the OCP Server Project exists to form a healthy ecosystem in the network interface card space. It is a community-driven initiative that develops and promotes open, disaggregated NIC solutions for the data center. Its charter covers specifications and standards for OCP NICs and their hardware and firmware interfaces so that vendors' products interoperate; encouraging innovation on new NIC technologies for the data center and enterprise server industry; promoting adoption of OCP NICs through education and awareness; fostering a community of developers, users and vendors; and providing a forum for members to share experiences, best practices and use cases and solve common challenges together.

Open Chiplet Economy

The Open Chiplet Economy Sub-Project, under the OCP Server Project, brings the modularization trend that reshaped data center hardware to the foundations of computing. As high-performance and domain-specific SoCs grow larger and costlier, chiplets offer a disaggregated, modular alternative using advanced 2D and 3D system-in-package engineering. The Sub-Project, together with its area of the OCP Marketplace, is where the OCP Community applies open collaboration and standardization across the scope of chiplets. Its upstream work covers the EDA tools and flows for chiplet-based design, the collateral and economics of building a SiP from chiplets, and the interfaces that connect chiplets, with workstreams in each area producing specs, white papers and methodologies.

Type 1

Type 1 is a Workstream under the Data Center Secure Control Module (DC-SCM) Sub-Project of the OCP Server Project. The DC-SCM specification separates common platform management and security hardware and places it behind a connector specified by its pin-out, the Datacenter Secure Control Interface (DC-SCI). The DC-SCM specifications library includes the OCP HPM Common Circuit Type 1 Specification and Pinlist. Details about the workstream’s mission, scope, deliverables, and ways to get involved will be added in the near future.

Type 2

Type 2 is a Workstream under the Data Center Secure Control Module (DC-SCM) Sub-Project of the OCP Server Project. The DC-SCM specification separates common platform management and security hardware and places it behind a connector specified by its pin-out, the Datacenter Secure Control Interface (DC-SCI). The DC-SCM specifications library includes the OCP HPM Common Circuit Type 2 Design Specification and Pinlist, posted for public review. Details about the workstream’s mission, scope, deliverables, and ways to get involved will be added in the near future.