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Workstream Overview
The DC-SCM module specification separates the common platform management and security hardware and places them behind a connector. The module is specified by its connector pin-out called DC-SCI. The module may have one or more form-factors.
Charter
This Workstream creates designs and specifications to enable interoperable hardware for platform Security and Manageability, in the form of standardized DC-SCM Module. Deliverables from this project will include:
- Specification for the Datacenter Secure Control Interface (DC-SCI) between the DC-SCM Module and Host Processor Module (HPM)
- Electrical, Mechanical, Functional and Logical requirements for platform designers
- Design specifications for interoperable DC-SCM and HPM modules
Active Documents and Specs
Note: Documents published below are either Final Release Candidates or early versions posted for public review and feedback. The final versions of specifications are published in the Contribution Database after Final Specification Agreements (FSA) are signed.
| Type | Description | Revision | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|---|
| Specification | OCP DC-SCM Rev 2.2 Ver1.0 OCP DC-SCM LTPI Rev1.2 Ver1.0 OCP DC-SCI Rev2.2 Ver1.0 OCP DC-SCM2.2 CFF step files Rev2.2 Ver1.0 | 2.2 | October 16, 2025 | Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated October 2025 |
| Specification | OCP DC-SCM 2.1 VFF Drawings OCP DC-SCM Rev 2.1 Ver1.1 OCP DC-SCM Rev 2.1 Ver1.1 Errata 1 OCP DC-SCI Rev2.1 Ver1.1 OCP DC-SCM LTPI Rev2.1 Ver1.1 | 2.1 | June 28, 2024 | Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated November 2024 |
| Specification | OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 1.0 OCP HPM Common Circuit Type 1 Specification Rev 1.0 Ver 1.0 | 1.0 | August 21, 2024 | Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Jabil Inc.; Microsoft Corporation; Nuvoton Technology Israel Ltd. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated September 2024 |
| Specification | OCP HPM Common Circuit Type 2 Pinlist Ver 0.3.0 OCP HPM Common Circuit Type 2 Design Specification Rev 1.0 Ver 0.7 | 0.7 | August 19, 2025 | AMD, ASPEED, Dell, HPE, IBM, Intel, Jabil, Lenovo, Nuvoton | Modified OWFa 1.0 CLA (modified 07/2021) | |
| Specification | OCP DC-SCM Rev2.0 ver1.0 specification candidate OCP DC-SCI Rev2.0 ver1.0 candidate OCP DC-SCM Rev2.0 Security Considerations candidate OCP LTPI specification ver1.0 specification candidate OCP DC-SCM Rev2.0 mechanical files candidate | 2.0 | July 27, 2022 | Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated July 2022 Approved by IC |
| Specification | OCP DC-SCM Rev 1.0_release_to_OCP.pdf OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf | 1.0 | 3/26/2021 12/02/2020 11/10/2020 | Microsoft & Google | OWFa 1.0 CLA | 05/26/2021 • approved by IC, available on the contributions portal 03/26/2021 • For submitting into the contribution database 12/02/2020 • For review in November IC calls 11/11/2020 • For review in November Server and HW-MGMT project calls |
Reference Designs and Implementations
| Type | Description | Version | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|---|
| Reference Design | DC-SCM 2.0 Reference Design following DC-SCM 2.0 Specification DC-SCM 2.0 Custom 1U VFF DC-SCM 2.0 Custom 1U VFF Design Collaterals | v1.0 | 10/15/2023 | Axiado | – | Product available in Marketplace |
| Reference Design | DC-SCM 2.0 Reference Design following DC-SCM 2.0 Specification DC-SCM 2.0 HFF DC-SCM 2.0 HFF Design Collaterals | v1.0 | 5/15/2023 | Lenovo, Cloudflare | – | Product available in Marketplace |
| Reference implementation | DC-SCM LTPI IP Reference Implementation Github Repository | v1.0 | 3/3/2023 | Intel | MIT | Approved |
| Reference Design | DC-SCM 1.0 Reference Design following DC-SCM 1.0 Specification DC-SCM 1.0 HFF DC-SCM 1.0 HFF Design Collaterals DC-SCM 1.0 VFF DC-SCM 1.0 VFF Design Collaterals DC-SCM 1.0 ROT DC-SCM 1.0 ROT Design Collaterals | v1.0 | 5/26/2022 | AMD | – | Approved |
DC-SCM 2.0 Workgroup
Public Meetings
The DC-SCM Workstream provides public updates at MHS Monthly Public Meeting Refer to MHS Public Meetings Calendar
Presentations
- OCP Global Summit 2023 Modular Hardware Management update
- OCP Global Summit 2023 DC-SCM LTPI Reference Implementation Contribution from Intel
- OCP Global Summit 2023 Project Argus DC-SCM 2.0
- OCP Global Summit 2023 Empowering OCP with Axiado’s Single-Chip DC-SCM Card – presented by Axiado
- OCP Global Summit 2023 Driving DC-SCM innovations and interoperability – presented by DC-MHS
- OCP Global Summit 2023 DC-SCM Based Advanced Cooling Manager: Rapid leakage protection and cooling management in rack and tank level liquid cooling systems
- OCP Global Summit 2022 DC-SCM 2.0 and Beyond
- OCP Global Summit 2022 DC-SCM 2.0 LTPI v1.0 Specification Updates
- OCP Global Summit 2022 DC-SCM and GXP Asic bridging the gap
- OCP Global Summit 2022 Implementation of multi-partition Boot in CPUs with DC-SCM
- OCP Global Summit 2022 Protecting Open-Source Firmware via HRoT- FPGAs- and DC-SCM
- OCP Global Summit 2022 DC-SCM threats and mitigations
- OCP Global Summit 2022 DC-SCM into 2U & Wide Chassis
- OCP Global Summit 2022 DC-SCM Next
- OCP Global Summit 2021 DC-Stack Overview Executive Talk
- OCP Global Summit 2021 DC-Stack Overview Expo Hall Talk
- OCP Global Summit 2021 DC-Stack Software
- OCP Global Summit 2021 DC-MHS
- OCP Global Summit 2021 DC-XPI
- OCP Global Summit 2021 Introduction of DC-SCM 2.0 LVDS Tunneling Protocol & Interface (LTPI)
- OCP Global Summit 2021 Intel DC SCM 2.0 Prototype Demo
- OCP Global Summit 2021 Intel DC SCM 2 0 LTPI Demo
- OCP Global Summit 2021 DC-SCM 2.0 update
- OCP Global Summit 2021 DC-SCM 1.0 update
- OCP Global Summit 2019 DC-SCM concept introduction
- OCP Regional Summit 2019 DC-SCM progress report
- OCP Regional Summit 2019 DC-SCM for OAI
Get Involved
- Participate in the discussion, mailing list: DC-SCM Mailing List Info
- Participate in MHS Monthly Public Meetings: Refer to MHS Public Meetings Calendar