Submissions are now open for the 2026 OCP Global Summit Innovation Village. Submit for a station before June 30, 2026.
OCP Innovation Village – a shining example of OCP’s collaborative spirit! This dynamic space celebrates the groundbreaking work of our community members who are actively contributing to OCP Projects and shaping the future of open hardware.
Discover prototype demonstrations from teams working on OCP Acceptedโข and OCP Inspiredโข innovations. Watch emerging specifications come to life, and connect with fellow contributors who are pushing the boundaries of open infrastructure. Make sure to visit these exciting areas and see the latest breakthroughs from the OCP Community!
Make sure to visit these exciting areas and see the latest breakthroughs from the OCP Community!
Innovation Village is your opportunity to:
- Engage with active participants of OCP Projects
- Experience early-stage technologies being developed within OCP workstreams
- Share ideas and explore collaboration opportunities with other contributors
- Help shape the evolution of new OCP specifications
Why Visit the Innovation Village?
Hands-on discovery
See real demos from companies shaping the future of compute, networking, storage, and data centers.
Collaborative innovation
Explore early-stage concepts that are evolving to meet market needs.
Direct engagement
Meet the engineers and innovators driving these breakthroughs to learn and share your feedback.
Questions?
OCP Global Summit 2026: Innovation Village & Future Technologies Symposium (FTS) Demo Lineup
See emerging infrastructure technologies in action at the 2026 OCP Global Summitโs Innovation Village, featuring demonstrations from the Future Technologies Symposium (FTS) and across the OCP Community. Explore the lineup below, organized by technical zone, for working prototypes, live demos and interactive displays spanning liquid cooling, power delivery, chiplets, optical networking and data center roboticsโand make time in your Summit schedule to take a closer look.
FTS โ Cooling
- Phasic Energy โ “Modular Additively Manufactured Heat Exchanger“: A 1 MW (2×500 kW) additively manufactured wavy-plate heat exchanger sized to the OCP Project Deschutes CDU architecture, with a live thermal-design tool visitors can drive.
- ZutaCore โ “Direct-to-Die Two-Phase Cooling”: A fully operational Blackwell server with a transparent window showing live flow-boiling over the GPU under real AI workloads.
- apheros โ “Metal Foams for Next-Generation Cold Plates”: An open-porosity metal foam substrate for direct-to-chip cold plates, with physical prototypes to inspect.
- UniSCool โ “Self-Adaptive Coldplate for DTC”: Adaptive direct-to-chip liquid cooling technology, building on last year’s Future Technologies Symposium award.
FTS โ Interconnect
- LightXcelerate โ “High Bandwidth and Efficient CPO by microVCSEL”: A live co-packaged optics engine built on backside-emitting VCSEL arrays and multicore fiber.
- Point2 Technology โ “e-Tube RF over Plastic”: RF signal transmission over plastic dielectric waveguides as a copper alternative for multi-terabit AI cluster interconnect.
FTS โ Power
- Nlevel โ “Real-Time Energy Routing (RER)”: A hands-on physical prototype of an open, masterless power-routing architecture, with live simulated-failure handling.
- Symphonic Energy โ “Battery Intelligence for Safety and Sustainability”: A live 48V battery/AI-server tabletop demonstrating on-prem, cell-level battery monitoring applicable to OCP’s Mt Diablo ยฑ400V architecture.
- CelLink โ “Flex Circuit: High Power Delivery” A flex-harness power distribution approach, with side-by-side thermal/voltage comparisons against conventional wire harnesses.
- XMight Smart Energy โ “No Central UPS, Still Grid-Code-Ready (DPO)”: An open, vendor-neutral rack-level coordination layer for meeting grid codes without a central UPS, extending several OCP power specs.
DC Automation
- Americase International – “The Chemistry of Change”: Three OCP member companies (Zฤlos Energy, MPI Energy, PHS West) demonstrate nickel-zinc battery chemistry running real data center equipment, tied to the OCP Data Readiness Working Group’s published framework.
- Meta – “Robotics for Datacenters”: AGVs moving standard and non-standard racks, plus inspection robots, spanning both construction and steady-state operations. (JTEC, BEWA, & DS Automation) An end-to-end vision for autonomous inspection, transport, and in-rack maintenance (e.g., SSD/BBU swaps) via robotics and physical AI.
HW Mgmt
- Altera & Antmicro โ “Agile SoC OpenBMC Implementation”: Featuring two demos showing how the same FPGA SoC family can scale from basic chassis management to full DC-SCM implementation, all running OpenBMC.
- HPE โ “Platform Firmware Ethernet Streaming”: An open-source, hardware-enforced firmware-streaming approach for BMC firmware security.
IT Infra
- HPE & Intel โ “OCP MHS Modular Plug-and-Play (M-PNP) Workstream POC”: A joint demonstration showing modular plug-and-play interoperability under the OCP MHS Server Project.
- Teledyne LeCroy โ “OCP Datacenter NVMe SSD Specification Compliance”: Validation test setups and drive evaluation tools aligned with the OCP NVMe SSD specification, developed alongside Microsoft and Solidigm.
- Portwell & Broadcom โ “Next-Gen PCIe Interconnect Architecture”: Prototype hardware showing modular platform expansion and high-speed PCIe fabric integration across data center nodes.
- Intel, Dell & Meta โ “OCP NIC 3.0 Liquid-Cooling Thermal Design”: Physical mockups and thermal reference concepts updating the NIC 3.0 form factor for liquid-cooled server architectures, developed with the OCP NIC community.
OBMF (Open Boot and Management Framework)
- Nuvoton, ASPEED, Intel, AMD, NVIDIA, Arm, Marvell, NXP โ “OBMF-ICP Interoperability & Telemetry Demo”: Features six initial OBMF-ICP protocol implementation demos and an interoperability plug-fest, highlighted by running OBMF-ICP via USB for real-time SMC-to-BMC telemetry and Node Manager functions. The exhibit demonstrates how the protocol simplifies system architecture, outlines the OBMF-ICP 1.0 specification release timeline, and includes an on-stage quick talk overviewing the technology.
OCE (Open Chiplet Economy)
- Palo Alto Electron โ “FCSA Digital Twin: Chiplets to Clusters Modeling”: Demonstrate building composable systems to show the industry the value of FCSA in building composable chiplet systems.
- Baya Systems โ “High-Radix NoC Switching: Rethinking Scale-Up Fabric for the Chiplet Era”
- Elyan โ “Chiplet Interconnect Solutions that Break Through the I/O Wall”: New BoW D2D and C2C interconnect silicon demos for chiplet applications. Demonstrates to the industry how low-power and high-performance BoW D2D solutions can help enable chiplets for the open chiplet economy.
- YorChip โ “Chiplets for Breaking the Memory Wall”: Demonstrates a Memory Wall design, highlighting how chiplets can help address the memory wall barrier in AI applications.
- ASE โ “Advanced Packaging Solutions for Chiplet Integration”: Showcase of advanced packaging breakthroughs designed to scale modular chiplet architectures effectively.
OCS (Optical Circuit Switching)
- Foreal Spectrum โ “Deterministically-Scheduled Full Optical Networks for AI”: An AI data center scale-out network built entirely from optical circuit switches and NRZ transceivers, with two deterministic control approaches.
- PhotoBit.ai โ “Optical System for Next Generation”: Next-gen optical scale-out architecture and interconnect solutions.
- Lumotive โ “Metasurface-Based Optical Circuit Switching”: A 1×2 optical routing proof-of-concept using metasurfaces to dynamically direct inputs, validated with transceivers and bit error rate testing to demonstrate zero data degradation alongside low-loss, solid-state, high-radix, and rapid reconfiguration benefits.
TAP (Time Appliances Project)
- Oscilloquartz (Adtran) โ “Resilient, Zero-Trust A-PNT Timecard”: A multi-receiver GNSS/LEO timecard meeting both OCP-TAP and IEEE p3335 specs, with anti-spoofing protection.
- Ping Things โ “Sub-Microsecond Data Ingestion & Synchronization”: A reference data layer preserving nanosecond-resolution timestamps for hyperscale operations.
- Meinberg USA โ “Wireless Time Transfer for Data Center Campus Time Sync”: A PTP wireless backup demo using NICT’s Wi-Wi technique.
- NICT โ “Receive-Only Wireless Time Distribution”: Passive receive-only timing nodes complementing PTP/GNSS infrastructure.
- Broadcom โ “Silicon-Based PTP Capabilities”: PTP capabilities in networking silicon with SAI support for AI datacenter and service-provider networks.
Are you looking for an area to showcase your commercial OCP solutions? Our main exhibition area is dedicated to market-ready products. You can find information about our sponsorship opportunities here.
