The Innovation Village at the 2024 OCP Global Summit offers an engaging platform for attendees to explore the latest innovations of the Open Compute Project Community, and experience emerging technology that is likely to end up in tomorrow's products showcased by startups, academics and researchers.
Innovation Village visitors will encounter both live and static hardware demonstrations, showcasing racks, servers, components, and switches designed to enhance efficiency and meet the demands of hyperscale, enterprise, and edge data centers.
Engineers from our community will be available to illustrate how open designs are more impactful, sustainable, improve scalability, and boost efficiency. Attendees will also have the opportunity to interact with emerging technology prototypes, gaining insights into how the OCP fosters innovation through collaboration among tech giants, startups, academics and a diverse global network of developers and suppliers.
Join us in the Innovation Village to experience firsthand the transformative impact of the Open Compute Project and its continually evolving future technologies, hardware designs and specifications.
The Innovation Village can be found in two locations: (1) Collaborative OCP Projects located in the Expo Hall, and (2) on the lower mezzanine (foyer of rooms LL20BC) with OCP’s Future Technologies Symposium (FTS) on October 16th only.
Innovation Village Collaborative OCP Projects Stations in the Exhibit Hall
Station 1: Open Chiplet Economy - sponsored by ASE, Inc.
Participating Companies: Alphawave Semi, Ampora, Anemoi Software Inc, ASE, Inc. Blue Cheetah Analog, Eliyan Corporation, Fermi Lab, Lawrence Berkeley Lab, Synopsys, YorChip Inc.
An extensive and diverse array of products and prototypes is on display, highlighting the latest advancements in chiplet-based solutions, chiplet intellectual property (IP), and chiplet workflows. This collection brings together innovations from various sectors of the open chiplet economy, illustrating the collaborative efforts driving this technology forward.
Station 2: DC Physical Infrastructure
Participating Companies: AMD, Credo, Delta Electronics, Gigabyte, Google, Jtec Industries, Meta, Micron, MOLG, MSI, Pape Material Handling, Penguin, PNY, Rittal, Smart Modular, Yale Lift Truck Company, XConn
Generative AI and the disaggregation of traditional servers with technologies such as CXL are having a massive impact on hyperscale data centers (HSDCs). This station is a mechanical representation of how HSDCs will be built in 2025, and it provides a glimpse into how they may change in the future. Rack and Power focused partners will build a row of compute servers showcasing the evolution of cooling, new automation technology, an evolution of DC Interconnect, and a demonstration of servicing new liquid cooling systems.
Station 3: Composable Memory System (CMS)
Participating Companies: Astera Labs, Micron, Seagate, Jackrabbit Labs, Elephance Memory, H3 Platform, Xconn Technologies, Altera (An Intel Company), ZeroPoint
This station is showcasing the latest technologies within the CMS project, including: Architectural enablement using external PCIe cabling, including the cabling ecosystem and interoperability. CXL-based solutions driven by the OCP CMS sub-project, demonstrating that these solutions are deployable and that the multi-vendor ecosystem is working to make them scalable. Elastic memory takes pooling to the next level with true automation and management across many servers connected to the memory appliance.
Station 4: Server
Participating Companies: AMD, Altera, AMI, ASPEED, Axiado, Intel Corporation, HPE, Jabil, Meta, Samsung
At our station, we will showcase advanced Open Source Firmware solutions, including network-based booting without firmware and secure OpenBMC images. Attendees will see the M-CRPS's ability to combine power supplies from different vendors and customize configurations. We'll also present the first prototype of the DC-SCM 2.1 Type-1 Module and demonstrate DC-SCM 2.x tunneling solutions for multiple nodes. Our display includes both 1U and 2U DC-MHS-inspired chassis, featuring live swaps of DC-HPMs and DC-SCMs. Visitors can explore the security features of the Axiado DC-SCM and new technologies like a Large Memory System layout and E3.S CXL memory.
Station 5: Time Appliances Project (TAP)
Participating Companies: Intel, Broadcom, Nvidia, Meinberg, Safran, Adtran, Infleqtion, GuideTech, SiTime, NICT, Iridium and Renesas.
The TAP Station at Innovation Village will be a plugfest to test the interoperability of the innovations in this group. Time Appliances Project (TAP) aims to provide a platform to bring together, discuss, standardize and share technologies and solutions across industries with the datacenter applications and data center network infrastructure as the main interest. The project aims to bring together the community of datacenter operators, application developers, and equipment and semiconductor companies together to enable datacenter time-sensitive applications such as consistency in distributed systems, edge computing, AR/VR and IoT. These applications will greatly benefit from high accuracy, reliable, and scalable distribution and synchronization of time.
Station 6: OCP Networking/NIC
Participating Companies: Broadcom, Dell, Google, Meta, Intel, Broadcom, Spirent
At this station, participants will showcase AI servers built with open ecosystem components, including CPUs, GPUs, and NICs, connected via Ethernet switches. Attendees will see standard AI benchmarks and applications running on these servers, highlighting how the open ecosystem facilitates scalable AI systems. We’ll feature next-generation servers designed for AI at scale, demonstrating community-driven design principles. Our compact appliance will accommodate OCP SFF and DSFF NICs, with interactive samples to illustrate their versatility. Additionally, we will demonstrate Falcon's full stack performance for HPC and AI/ML using IPU hardware and showcase the new Dual Small Form-Factor (DSFF) NIC specification with physical samples integrated into a DC-MHS motherboard, complemented by a digital presentation highlighting the updates.
Station 7: OpenRAN
Participating Companies: Lattice Semiconductor, Massive Massive Beams, Rapid Space
This effort is focused on bringing the extended community of operators, manufacturers, component and subsystem producers, consultants, open organizations, test and measurement vendors, certification labs, and integrators, to name a few, together to build the specifications for a truly open radio platform for 5G and beyond. By defining a common open radio unit platform with extensive modularity, a common base can be shared. This common base will allow for new opportunities such as being easy to build and deploy and customize with software/firmware/hardware etc, or even proprietary solutions onto the platform.
Station 8: Quantum
Participating Companies: Lawrence Berkeley Labs, Senko, Quside
This station is a showcase of quantum technologies, including an overview of quantum hardware and its applications. Quside will present their quantum entropy chips integrated into various electronic modules, such as compact PCBs and PCIe cards, demonstrating how this technology is ready for new platform architectures. Additionally, we will feature a packaged photonic integrated circuit module developed by SENKO and partners for quantum applications, highlighting the innovative Cudoform metallic PIC connector as a key component. This demonstration will illustrate the potential of quantum hardware in driving next-generation technologies.
Innovation Village Emerging Technologies Demos Located with FTS
Emerging Technologies Demonstrations, showcasing the latest innovations in data center and AI technologies. This event promises to be an exciting platform for industry leaders to share their cutting-edge solutions, and we've got a sneak peek at what's in store.
Cooling and Thermal Management
Several demos will focus on advanced cooling and thermal management solutions, including:
- Accelsius - Two-phase, direct-to-chip liquid cooling solution, demonstrating a Vaporator that can handle 1,000W per socket.
- WoodenDataCenter - Next Generation AI Rack, integrating liquid cooling and high-capacity busbar systems for 150+ kW racks.
- ZutaCore Ltd. - Two-phase cooling based Modular Data Center for AI factories, featuring 2.8kW cold plates.
Power Delivery and Efficiency
Other demos will highlight innovative power delivery and efficiency solutions, including:
- DG Matrix - Power Blade, a breakthrough 80-kW 1U power shelf configuration designed for AI loads.
- Empower Semiconductor - Vertical power delivery solution, eliminating power delivery bottlenecks to enable higher computing power.
Sustainability and Circular Economy
Sustainability and circular economy will also be a key focus, with demos from:
- Phasic Energy - Demonstrating their Phasic Heat Engine for data center waste heat recovery.
- Sims Lifecycle Services - Showcasing their collaboration with Qarnot to repurpose hyperscaler hardware into new servers that can reuse heat and eliminate cooling needs.
AI and Firmware
Finally, demos will also cover AI and firmware innovations, including:
- Blindspot Software GmbH's - AI-Powered firmware test automation framework.
- Proteantecs - On-chip monitoring and analytics solutions.
The Open Compute Project Future Technologies Symposium Emerging Technologies Demonstration promises to be an exciting event, offering a glimpse into the future of data centers.
Don't miss the opportunity to learn from industry leaders and experience the latest innovations first hand. Mark your calendars for Wednesday, October 16th, and get ready to explore the future of technology.