Open Chiplet Economy

The Open Chiplet Economy Sub-Project, under the OCP Server Project, brings the modularization trend that reshaped data center hardware to the foundations of computing. As high-performance and domain-specific SoCs grow larger and costlier, chiplets offer a disaggregated, modular alternative using advanced 2D and 3D system-in-package engineering. The Sub-Project, together with its area of the OCP Marketplace, is where the OCP Community applies open collaboration and standardization across the scope of chiplets. Its upstream work covers the EDA tools and flows for chiplet-based design, the collateral and economics of building a SiP from chiplets, and the interfaces that connect chiplets, with workstreams in each area producing specs, white papers and methodologies.

Open Chiplet Economy

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Steering Committee Representative

Gregory D Sellman

Project Leads

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About This Sub-Project

Open Chiplet Economy

The Open Chiplet Economy Sub-Project is under the direction of the OCP Server Project Group.

Just as a strategy of modularization has impacted data center hardware at large, from design to operations, so too is this trend coming to the foundations of computing. High-performance and domain-specific system-on-chip (SoC) compute architectures have grown larger and more expensive to produce, and chiplets are the disaggregated, modular equivalent, with new advanced 2D and 3D system-in-package (SiP) engineering. This Open Chiplet Economy OCP Sub-Project and the corresponding area of the OCP Marketplace are where the OCP Community applies open collaboration and standardization across the scope of chiplets.

Work Areas

Each of the scope categories has a number of workstreams working collaboratively to develop coherent specs, white papers, methodologies, etc. for an open chiplet market to thrive.

Economy Booster
Business Chiplet Workstream HPC Modularity PoC
 
Chiplet Design Tools
CDX-3DK CDX-Flow
 
Open Interfaces
BoW Phy Metrics D2D Test Link Layer

Learn More and Get Involved

Find more information about the individual workstreams under the OCE on the wiki, and ramp up with the OCP Academy eLearning courses.

OCE Workstreams on the WikiOpen Chiplet Economy eLearning on OCP Academy

Scope

The Open Chiplet Economy Sub-Project is where the upstream work happens in the Community. It deals with multiple aspects of building a selection of chiplets into a SiP. The main aspects of this work are:

  • EDA tools and flows : the Electronic Design Automation tools and flows needed to enable chiplet-based design workflows.
  • Collateral and economics : the collateral needed to build a SiP consisting of chiplets, with a business component that looks at the economics of chiplets and how that changes the marketplace.
  • Interfaces : the interfaces that connect chiplets together.

Resources

Operating under the OCP Server Project umbrella.

General Information

Charter

– Intro to Open Chiplet Economy (formerly known as ODSA) – ODSA/Open Chiplet Economy Open Accelerator Architecture


Open Domain-Specific Accelerators / Open Chiplet Economy: What Are They & Why Should They Matter?

– ODSA/Open Chiplet Economy webinar with Light Reading: December 19th, 2018 – ODSA/Open Chiplet Economy White Paper


eLearning Training: Open Chiplet Economy:

– 9-part courses series on the Business and Technology of Chiplet-based Systems now on OCP Academy

Active Workstreams/Calls

Project Objective Point of Contact Meeting Schedule Call Link
Open Chiplet Economy Main OCE meeting, used to coordinate workstreams, and discuss topics that don’t fit into any active workstream. Anu Ramamurthy, Jawad Nasrullah, Mark Knight Weekly on Friday 8 am PT Call Link
BoW PHY Interface Bunch of wires, open source, easy-to-port inter-chiplet (die-to-die) interface specification Kevin Donnelly and Morgan Whately Weekly on Wednesday 9 am PT Call Link
BoW PHY Interface Bunch of wires, open source, easy-to-port inter-chiplet (die-to-die) interface specification Kevin Donnelly and Morgan Whately Weekly on Thursday 1:35 pm PT Call Link
CDX/3DK/MDK 3DIC Material Design Kits standardization Tony Mastroianni TBD TBD
Chiplet Design Exchange (CDX) Open chiplet physical description format David Ratchkov Alternate Thursdays @ 10 am PT Call Link
Chiplet PoC Proof of concept chiplet integration and packaging for emerging AI/HPC applications TBD TBD TBD
Chiplet Systems Multi Vendor Chiplet Interoperability Itai Nadler, Rob Pelt Weekly, Wednesday, 11am-12pm PT Call Link
Foundation Chiplet System Architecture (FCSA) Foundation Chiplet System Architecture Meeting Dominic Brown (Arm), Mark Knight (Arm) Alternate Mondays @ 8 am PT Call Link
HPC & AI Modularity Identify specialization opportunities, Identify supporting technologies and standards Tony Gutierrez, Georgios Michelogiannakis, Patricia Gonzalez-Guerrero Bi-Weekly on Tuesdays 9 am PT Call Link
Lightweight Serial Interconnect This workstream focuses on defining an open, lightweight framing approach for modular system connectivity. Allan Cantle Commencing Tuesday 23rd June at 10 am PT Call link
Link Layer D2D Link Layer interface and implementations Brian Murray Weekly on Thursday 9 am PT Call Link
Virtual Chiplet Ecosystems Open Framework for Chiplet Virtual Prototyping Raghu Shankar Weekly on Thur 8 am PT (paused until Jan 2027) Call Link

Some workstreams are intended to be short-lived. For details of former workstreams that are now inactive see: Open Chiplet Economy Archive

Active documents

Type Description Version Submit Date Contributors License Notes
Video Series Why Chiplets, Architectures, Packaging, D2D interfaces, Testability, Cost, Interoperability, Marketplace, Call to Action 1.0 2025 Microchip, Analog Devices, Intel, NXP, Cadence, Entrepreneur, Ampora, Blue Cheetah, Yorchip Creative Commons 10 mins x 9 sections
Training Series Why Chiplets, Architectures, Packaging, D2D interfaces, Testability, Cost, Interoperability, Marketplace, What’s Next 1.0 2025 Microchip, Analog Devices, Intel, NXP, Cadence, Entrepreneur, Ampora, Blue Cheetah, Yorchip OCP Academy 10 mins x 9 sections
White Paper DEVELOPING AN OPEN CHIPLETS MARKETPLACE: CHALLENGES AND OPPORTUNITIES 1.0 2/23/2022 Microchip, IBM, Meta, JCET, ARM, Samsung, Google, Teradyne Creative Commons License
Introduction odsa_ocp_intro.pdf n/a 2/27/19 Netronome n/a Presented in 2/27 Server WG call.
White Paper (Draft) Bunch of Wires Interface Proposal Rev 0.7 10/26/19 Authors: Mark Kuemerle, Ramin Farjad, Bapi Vinnakota OCP CRLA
White Paper (Released) Developing an Open Chiplets Marketplace: Challenges and Opportunities n/a 2022 Authors: ARM, Google, IBM, JCET, Meta, Microchip, Samsung Electronics, Teradyne Creative Commons License

Meeting Schedule & Call Link

  • Weekly Main Open Chiplet Economy Call: Every Friday at 8am Pacific

Call Link (visit the OCP Open Chiplet Economy Sub-Project Calendar for other dial-in information)

  • Open Chiplet Economy Workstream Calls

– PoC workstream meeting – Tuesdays 8 AM Pacific – Bunch of Wires meeting – Wednesdays 9 AM Pacific – Bunch of Wires Test Chip meeting – Wednesdays 10 AM Pacific – Link Layer meeting – Thursday 9 AM Pacific

Worksteam Calls Link

These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project’s wiki page and are open to the public in accordance to OCP’s Bylaws and IP Policy. This can be found at http://www.opencompute.org/about/ocp-policies/. If you have any questions please contact OCP.

Upcoming In Person Meetings

– Open Chiplet Economy Groups.io Calendar

Recordings from Past Calls

Click HERE to view recordings from the various Open Chiplet Economy (Previously ODSA) Workstream Calls

Open Chiplet Economy Archive

Please see our archive wiki page for older content that has been moved away from this page as it had become a little long:

– Open Chiplet Economy Archive

Call Calendar

These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project’s wiki page and are open to the public in accordance to OCP’s Bylaws and IP Policy. This can be found at http://www.opencompute.org/about/ocp-policies/. If you have any questions please contact OCP.

Open Chiplet Economy calendar

Related Details

Contributions

All project contributions

Sub-Projects

3DIC Assembly Design Kits standardization

3DIC Assembly Design Kits Standardization is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.

3DIC Material Design Kits standardization

3DIC Material Design Kits Standardization is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on 3DIC Material Design Kits standardization. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

AH3C NAPMP Chiplet Ecosystem

AH3C NAPMP Chiplet Ecosystem is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.

Bunch of Wires

Bunch of Wires is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on the Bunch of Wires (BoW) open-source, easy-to-port inter-chiplet (die-to-die) interface specification. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Bunch of Wires Test Chip

Bunch of Wires Test Chip is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.

Chiplet / SiP Test

Chiplet / SiP Test is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.

Chiplet Design Exchange

Chiplet Design Exchange is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on the open chiplet physical description format (CDX). Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Chiplet Systems

Chiplet Systems is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project, focused on multi-vendor chiplet interoperability: making it practical to build a system-in-package from chiplets sourced from different vendors. It addresses the system-level challenges of integrating interoperable chiplets across five areas: silicon and systems architecture, security, power efficiency, performance optimization, and an interoperability checklist of tests and guidelines. The workstream builds on progress made by UCIe, Bunch of Wires, and other OCE groups, collaborating with them to define best practices and standards for seamless chiplet-based system design.

Foundation Chiplet System Architecture

Foundation Chiplet System Architecture is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on the Foundation Chiplet System Architecture (FCSA). Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Lightweight Serial Interconnect

Lightweight Serial Interconnect is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on defining an open, lightweight framing approach for modular system connectivity. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Link Layer

Link Layer is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on the die-to-die (D2D) Link Layer interface and its implementations. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Open Framework for Chiplet Eco-system Virtual Prototyping

Open Framework for Chiplet Eco-system Virtual Prototyping is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on an open framework for chiplet virtual prototyping (Virtual Chiplet Ecosystems). Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

PHY FlexI

PHY FlexI is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.

PHY Interface

PHY Interface is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on the Bunch of Wires (BoW) open-source, easy-to-port inter-chiplet (die-to-die) interface specification. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.

Test Package PoC

Test Package PoC is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on a proof-of-concept product that integrates existing die from multiple companies into one package, for emerging AI/HPC applications. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.