Chiplet Systems

Chiplet Systems is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project, focused on multi-vendor chiplet interoperability: making it practical to build a system-in-package from chiplets sourced from different vendors. It addresses the system-level challenges of integrating interoperable chiplets across five areas: silicon and systems architecture, security, power efficiency, performance optimization, and an interoperability checklist of tests and guidelines. The workstream builds on progress made by UCIe, Bunch of Wires, and other OCE groups, collaborating with them to define best practices and standards for seamless chiplet-based system design.

Call for Participation (CFP) Open Framework for Chiplet Eco-system Virtual Prototyping

Get involved

Steering Committee Representative

Gregory D Sellman

Project Leads

About This Workstream


Workstream Leads: Durgesh Srivastava, Itai Nadler, Rob Pelt

Chiplet Systems is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. Its objective is multi-vendor chiplet interoperability: making it practical to build a system-in-package from chiplets sourced from different vendors.

The Workstream addresses the system-level challenges of integrating interoperable chiplets. It builds on the progress made by UCIe, Bunch of Wires (BoW) and the other OCE groups, and collaborates with them to define the best practices and standards that enable seamless chiplet-based system design.

Workstream Charter

The Workstream focuses on five areas:

Silicon and Systems Architecture — system-level architecture for interoperable chiplet integration
Security — security requirements for multi-vendor chiplet systems
Power Efficiency — power and thermal considerations across the package
Performance Optimization — performance across chiplet boundaries
Interoperability Checklist — the tests and guidelines that make a chiplet interoperable

Get Involved

Join the Workstream

Participation is open to the OCP Community. Start with the Sub-Project resources below.

Chiplet Systems Wiki

Open Chiplet Economy Sub-Project

Open Chiplet Economy Wiki

Open Chiplet Economy Mailing List

Chiplet Cost Model (Business Working Group)

Workstream Activity

Topic Lead Contributors
Silicon and Systems Architecture Rob Pelt Durgesh Srivastava, Salem
Security Durgesh Srivastava —
Power Efficiency / Thermal Monalisa Bora David, Salem
Performance Optimization TBD Gilberto (Open Chip)
Interoperability Checklist Rich Klinger Itai Nadler, Salem
PHY & Link Layer Alignment Itai Nadler Durgesh Srivastava, Salem
Packaging TBD —

Active Documents

Document Contributor Description Submitted
System Architecture Rob Pelt High-level definition of the system architecture May 2025
CMI-SMI3CP Bruno Lacroux SCMI/MCTP over I3C profile specification July 2026
CMI-SMI3CP Overview Bruno Lacroux Overview of the SCMI/MCTP over I3C profile specification July 2026

Reviewed Documents

Document Contributor Description
AMD Chiplet Architecture Rob Pelt AMD white paper
CHIPS NAPMP NOFO 2 Rich Klinger U.S. Department of Commerce / NIST National Advanced Packaging Manufacturing Program, Advanced Packaging R&D
Link Layer Specification Rev A OCE Link Layer Workstream Transaction and link layer specification for BoW interfaces

Sub-Project specifications and white papers, including the BoW 2.0 Specification and the Open Chiplets Marketplace white paper, are listed on the Open Chiplet Economy page.

Scope

The Chiplet Systems Workstream addresses the system-level challenges of multi-vendor chiplet interoperability, building on UCIe, BoW and the other OCE groups.

Silicon & Systems Architecture — architecture for interoperable chiplet integration
Security — security across multi-vendor chiplet systems
Power Efficiency — power and thermal considerations
Performance Optimization — performance across chiplet boundaries
Interoperability Checklist — tests and guidelines that make a chiplet interoperable

Resources

Operating under the OCP Server Project umbrella.

Project Objective Point of Contact Meeting Schedule Call Link
Chiplet Systems Multi Vendor Chiplet Interoperability Durgesh Srivastava, Itai Nadler, Rob Pelt Weekly, Wednesday , 11:00-12:00 PT Call Link

Workstream Charter

Primary focus of this workstream is drive a multi-vendor ( interoperability) chiplets.

This workstream will address the system-level challenges related to Interoperable chiplet integration, with a focus on:
Silicon and Systems Architecture
Security
Power efficiency
Performance optimization
Checklist to make chiplet interoperable [List of tests or guidelines]


We will build on progress made by UCIe, BOW, and other OCE groups, and collaborate to define best practices and standards that enable seamless chiplet-based system design.

Workstreams Activity Dashboard

Topic Primary member Other members Status Next steps
Silicon and Systems Architecture Rob Pelt Durgesh , Salem Initial plan preented by Rob Skeleton of the the actual document – 20/5
Security Durgesh Srivastava TBD TBD TBD
Power efficiency/thermal Monalisa Bora David , Salem TBD TBD
Performance optimization TBD Gilberto (open chip) Initial work Present initial document , 25 June
Cecklist Rich Klinger Itai , Salem TBD TBD
PHY & Link Layer alignment Itai Nadler Durgesh , Salem Initial excel table is created and located on drive Itai – add more fields
Packaging TBD TBD TBD TBD

Work group active documents

Name Contributor link Description Submit Date
System architecture Rob Pelt System Architecture System architecture high level definition 05/01/2025
CMI-SMI3CP Bruno Lacroux CMI-SMI3CP SCMI/MCTP over I3C Profile Specification 07/30/2026
CMI-SMI3CP Overview Bruno Lacroux CMI-SMI3CP-Overview SCMI/MCTP over I3C Overview on the Profile Specification 07/30/2026
TBD TBD TBD TBD TBD

Work group reviewed documents

Name Contributor link Description Submit Date
AMD chiplets Rob Pelt AMD chiplet architecture AMD white paper 05/01/2025
NOFO2 Rich Klinger NOFO2 U.S. Department of Commerce, NIST, National Advanced Packaging Manufacturing Program (NAPMP) , Advanced Packaging Research and Development (R&D) 05/01/2025
Link Layer spec Name Link Layer Specification REV A OCE Link Layer workstream 05/01/2025

OCE documents

Type Description Version Submit Date Contributor License Notes
BoW spec BoW 2.0 Specification 2.0 04/18/2023 OCE D2D workstream
Link Layer spec Link Layer Specification REV A 0.9 3/28/23 OCE Link Layer workstream n/a
White Paper (Draft) Bunch of Wires Interface Proposal Rev 0.7 10/26/19 Authors: Mark Kuemerle, Ramin Farjad, Bapi Vinnakota OCP CRLA
White Paper (Released) Developing an Open Chiplets Marketplace: Challenges and Opportunities 2022 Authors: ARM, Google, IBM, JCET, Meta, Microchip, Samsung Electronics, Teradyne Creative Commons License

Meetings description

Topic Date Video link Transcript
08/27 Recording Server/OpenChipletEconomy/ChipletSystems/ww34
08/20 Recording Server/OpenChipletEconomy/ChipletSystems/ww34
08/13 Recording Server/OpenChipletEconomy/ChipletSystems/ww33
Chiplet Interoperability ( Rich Klinger) 08/06 Recording Server/OpenChipletEconomy/ChipletSystems/ww32
07/30 Recording Server/OpenChipletEconomy/ChipletSystems/ww31
07/23 Recording Server/OpenChipletEconomy/ChipletSystems/ww30
Bump pitch 07/16 Recording Server/OpenChipletEconomy/ChipletSystems/ww29
Chiplet Interfaces 07/09 Recording Server/OpenChipletEconomy/ChipletSystems/ww28
Meeting Canceled 07/02 Recording Server/OpenChipletEconomy/ChipletSystems/ww27
Performance Optimization 06/25 Recording Server/OpenChipletEconomy/ChipletSystems/ww26
Chiplet Standards 06/18 Recording Server/OpenChipletEconomy/ChipletSystems/ww25
Power Efficiency 06/11 Recording Server/OpenChipletEconomy/ChipletSystems/ww24
Profile System 06/04 Recording Server/OpenChipletEconomy/ChipletSystems/ww23
Compatibility Framework 05/27 Recording Server/OpenChipletEconomy/ChipletSystems/ww22
Chiplet Management 05/20 Recording Server/OpenChipletEconomy/ChipletSystems/ww21
workstream setup 05/13 Recording Server/OpenChipletEconomy/ChipletSystems/ww20
workstream setup 05/06 Recording Server/OpenChipletEconomy/ChipletSystems/ww19
TBD TBD TBD TBD

Creating a new sub wiki page :
Step 1 : just write the name of the new page
for example example Server/OpenChipletEconomy/ChipletSystems/ww19
Step 2 : Ask Chat GPT to translate the Zoom transcript to wiki format and give a 2 words hedline
Step 3 : copy the translation to the page and add , link to original page
Link to original page : :- Back to OCE Chiplet Systems WIKI

Upcoming In Person Meetings

– Open Chiplet Economy Groups.io Calendar

Past Events

Topic Speaker Affiliation Slides Video
ODSA Introduction Bapi Vinnakota OCP Slides Recording

Click HERE to view recordings from the various Open Chiplet Economy (Previously ODSA) Workstream Calls

– Nov 15, 2024

Archive Wiki Pages

– 2019-2023

Chiplet Systems calendar