Test Package PoC
Test Package PoC is a workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on a proof-of-concept product that integrates existing die from multiple companies into one package, for emerging AI/HPC applications. Details about the workstream's mission, scope, and ways to get involved will be added in the near future.
About This Workstream
Test Package PoC is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project.
The Open Chiplet Economy Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets.
This workstream focuses on a proof-of-concept product that integrates existing die from multiple companies into one package, for emerging AI/HPC applications.
Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.
Scope
This workstream focuses on a proof-of-concept product that integrates existing die from multiple companies into one package, for emerging AI/HPC applications.
The full scope of this workstream will be added in the near future.