3DIC Material Design Kits standardization
3DIC Material Design Kits Standardization is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project. The Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets. This workstream focuses on 3DIC Material Design Kits standardization. Details about the workstream’s mission, scope, and ways to get involved will be added in the near future.
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Steering Committee Representative
Project Leads
About This Workstream
Workstream Leads: Tony Mastroianni
3DIC Material Design Kits Standardization is a Workstream under the Open Chiplet Economy (OCE) Sub-Project of the OCP Server Project.
The Open Chiplet Economy Sub-Project brings the modularization trend that reshaped data center hardware to the foundations of computing, applying open collaboration and standardization across the scope of chiplets.
This workstream focuses on 3DIC Material Design Kits standardization.
Details about the workstream’s mission and ways to get involved will be added in the near future.
Scope
This workstream focuses on 3DIC Material Design Kits standardization.
The full scope of this workstream will be added in the near future.