Open Chiplet Economy
- Project Leads
- Anu Ramamurthy, Jawad Nasrullah
The Open Chiplet Economy Sub-Project is under the direction of the OCP Server Project Group.
Just as a strategy of modularization has impacted data center hardware at large, from design and operations, so too is this trend coming to the foundations of computing. High-performance and domain-specific system-on-chip (SoC) compute architectures have grown larger and more expensive to produce, and chiplets are the disaggregated, modular equivalent with new advanced 2D and 3D system-in-package (SiP) engineering. This Open Chiplet Economy OCP Subproject and corresponding area of the OCP Marketplace is where the OCP Community applies open collaboration and standardization across the scope of chiplets.
Scope
The Open Chiplet Economy Subproject is where the upstream work happens in the Community. It deals with multiple aspects of building a selection of chiplets into a SiP . The main aspects to this work are,
- the Electronic Design Automation (EDA) tools/flows needed to enable the chiplet based design workflows,
- the collateral needed to build a SiP consisting of chiplets with a business component that looks at the economics of chiplets and how that changes the marketplace, and
- the interfaces that connect chiplets together.
Each of these categories has a number of workstreams working collaboratively to develop coherent specs, white papers, methodologies, etc. for an open chiplet market to thrive.
Active Projects & Call Schedule
Project | Objective | Point of Contact | Meeting Schedule | Call Link |
---|---|---|---|---|
D2D PHY Metrics | D2D PHY Metrics | Shahab Ardalan | Weekly on Tuesday 9:30 am PT | Call Link |
BoW PHY Interface | Bunch of wires, open source, easy-to-port inter-chiplet (die-to-die) interface specification | Elad Alon | Weekly on Wednesday 9 am PT | Call Link |
Test Package PoC | Proof of concept product that integrates existing die from multiple companies into one package | Jayaprakash Balachandran | Weekly on Wednesday 10 am PT | Call Link |
Link Layer | D2D Link Layer interface and implementations | Helia Naeimi | Weekly on Thursday 8:30 am PT | Call Link |
Chiplet Design Exchange (CDX) | Open chiplet physical description format | David Ratchkov | Weekly on Thursday 10 am PT | Call Link |
CDX/3DK/MDK | 3DIC Material Design Kits standardization | James Wong, Tony Mastroianni | Bi-weekly on Thursday 11 am PT | Call Link |
CDX/3DK/ADK | 3DIC Assembly Design Kits standardization | James Wong, Tony Mastroianni | Bi-weekly on Thursday 11 am PT | Call Link |
Business workflow | Chiplet business models | Marek Hempel | Weekly on Friday 9 am PT | Call Link |
D2D Test | D2D Test | Mike Bartley | Ad hoc | TBD |
HPC & AI Modularity | Identify specialization opportunities, Identify supporting technologies and standards | Tony Gutierrez, Georgios Michelogiannakis, Luisa Gonzalez | Meeting Schedule TBD | Call Link |
Open Chiplet Economy Sub-Project | Covers the entire sub-project | Anu Ramamurthy, Jawad Nasrullah | Weekly on Friday 8 am PT | Call Link |
Call Calendar
These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/. If you have any questions please contact OCP.
OCP Server - Open Chiplet Economy Calendar
The calendar displayed here is updated nightly from the project's Groups.io Calendar