The Innovation Village at 2026 OCP EMEA Summit

Date of Post
April 22, 2026
Posted by
Rob Coyle, Sr. Director of Member Experience

The Innovation Village at 2026 OCP EMEA Summit brings together hands-on technology demonstrations where participants can experience early-stage and emerging open hardware innovations directly. Below is a preview of the eight stations featured at this year’s event.

Data Center Automation

Meta

Robots are coming to the data center floor. See how autonomous systems handle heavy racks, and controlled de-ramping. This demonstrates how physical automation can scale alongside AI-era infrastructure demands.

Adaptive Cold Plate Cooling

UniSCool

UniSCool’s direct-to-chip liquid cooling adapts in real time to thermal demand, eliminating hotspots and delivering up to 80% energy savings over air cooling for high-density AI workloads.

OCP MHS Modular Plug-and-Play (M-PNP) Tools

Hewlett Packard Enterprise (HPE)

Interoperability should not require custom engineering every time. This station demos the M-PNP toolset that helps component vendors and system integrators adopt standardized management interfaces faster and with less friction.

Real-Time Energy Routing (RER)

Nlevel

Power delivery for 500kW to 1MW AI racks needs a new paradigm. RER treats electricity as software-defined packets routed through a resilient, decentralized grid.

OBMF End-to-End Demo

NVIDIA, Microsoft, NXP & ASPEED

Managing massive fleets of GPUs, SmartNICs, and accelerators demands unified, interoperable channels. This live cross-vendor demo running on OpenBMC and OpenSMA shows how OBMF over USB delivers scalable, standards-based device management today.

Generative AI Edge Inference

RaiderChip

What does sovereign AI look like at the hardware level? RaiderChip’s in-house NPU runs Language, Vision, Reasoning, and Audio LLMs at the edge with live demos you can test in your own voice, in your own language.

GaN-Based High-Efficiency Power Boards

Premium S.A.

Silicon is hitting its limits in the data center PSU. This station showcases GaN semiconductor prototypes achieving 97 to 99% efficiency, pointing toward a next generation of more compact, higher-density power supply designs.

Standardizing Embodied Carbon Disclosure

iMasons Climate Accord, Schneider Electric, Google, Microsoft, Meta

This station showcases the OCP-iMasons Embodied Carbon Disclosure Base Specification, a community-developed open framework that gives buyers and suppliers a common language for reporting the full lifecycle carbon impact of data center equipment.

Innovation Village Archives