Contributions

Welcome to the OCP Contributions Database. All contributions listed here have undergone a comprehensive validation process and are available for you to utilize in your own infrastructure. See what you can learn from these contributions, build on their expertise, share your experiences and give back to the Community. Join in the movement and contribute today!
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Showing 1–12 of 14 contributions

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  1. Modular-Extensible IO (M-XIO) Base Specification v1.04 RC1

    Contributor:
    Intel, AMD, Dell Inc. / Dell Technologies, Google, HPE, Meta, Microsoft
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  2. Platform Infrastructure Connectivity (M-PIC) Base Specification v1.11 RC1

    Contributor:
    Intel, AMD, Ampere Computing, Dell Inc. / Dell Technologies, Google, HPE, Jabil Inc., Meta, Microsoft, NVIDIA
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  3. Partial Width, Density Optimized HPM Form Factor (M-DNO) Base Specification, v1.1 RC2

    Contributor:
    Intel, Dell Inc. / Dell Technologies, Google, HPE, Meta, Microsoft, AMD, Jabil Inc., Ampere Computing, NVIDIA
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  4. Full Width HPM Form Factor (M-FLW) v1.2 RC3

    Contributor:
    Intel, Dell Inc. / Dell Technologies, Google, HPE, Meta, Microsoft, AMD, Jabil Inc., Ampere Computing, NVIDIA
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  5. Modular Scalable Density Optimized HPM Form Factor (M-SDNO) Base Specification v1.1 RC2

    Contributor:
    Intel, AMD, Dell Inc. / Dell Technologies, HPE, Ampere Computing, Google, Jabil Inc., Meta, Microsoft, NVIDIA
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  6. Modular-Peripheral Sideband Tunneling Interface (M-PESTI) Base Specification v1.2 RC2

    Contributor:
    Intel, Dell Inc. / Dell Technologies, Microsoft, AMD
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2025

  7. Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)

    Contributor:
    Dell Inc. / Dell Technologies, AMD, Ampere Computing, HPE, Intel, Jabil Inc., Meta, Microsoft, NVIDIA
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024

  8. M-CRPS_800W_Titanium_185mm_x 60mm_Design_Specification_1p00_RC3

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, AMD, NVIDIA, Google, Meta
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024

  9. M-CRPS_800W_Platinum_185mm_x 60mm_Design_Specification_1p00_RC3

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, AMD, NVIDIA, Google, Meta
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024

  10. M-CRPS_2400W_Titanium_185mm_x 73.5mm_Design_Specification_1p00_RC1

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, AMD, NVIDIA, Google, Meta
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024

  11. M-CRPS_1500W_Titanium_185mm_x 60mm_Design_Specification_1p00_RC3

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, AMD, NVIDIA, Google, Meta
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024

  12. M-CRPS_1100W_Titanium_185mm_x 60mm_Design_Specification_1p00_RC3

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, AMD, NVIDIA, Google, Meta
    Family:
    Server
    Project:
    Server > Modular Hardware System
    Release Year:
    2024