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  1. OCP FMFM (Fleet Memory Fault Management) Framework Requirements

    Contributor:
    Microsoft, AMD, Cisco, Dell Inc. / Dell Technologies, Intel, Meta, SKhynix, Google, Micron Technology, Samsung Electronics
    Family:
    HW Management
    Project:
    Hardware Management > Hardware Fault Management
    Release Year:
    2025

  2. Silent Data Corruption in AI Whitepaper v1.0

    Contributor:
    NVIDIA, Meta, Google, AMD, Intel, Arm, Microsoft
    Family:
    Information
    Project:
    Server
    Release Year:
    2025

  3. GUIDELINES FOR PRE-COMMISSION PREPARATION OF TECHNOLOGY COOLING SYSTEM (TCS) ROW MANIFOLDS IN LIQUID COOLED DATA CENTERS

    Contributor:
    NVIDIA, Nalco Water
    Family:
    Information
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025

  4. Reference Designs for Data Center Heat Reuse

    Contributor:
    Open Compute Project (OCP) Foundation
    Family:
    Data Center
    Project:
    Cooling Environments > Heat Reuse
    Release Year:
    2025

  5. 2P REFRIGERANT-BASED DIRECT LIQUID COOLING (DLC) TECHNOLOGY FOR NEXT GENERATION AI CLUSTERS WITH HIGH TDP ACCELERATORS

    Contributor:
    Intel, Vertiv, Parker-Hannifin, Accelsius
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025

  6. Warranty Guidelines for Immersion Cooled Technology Components

    Contributor:
    Supermicro, Seagate, Denvr Dataworks, Exxonmobil Product Solutions, FUCHS LUBRICANTS, Liquidcool Solutions, LiquidStack Inc., Micron Technology, Oleon, Promersion, Samsung Electronics, Soltex, Submer
    Family:
    Information
    Project:
    Cooling Environments > Immersion Cooling
    Release Year:
    2025

  7. WHITE PAPER: VISION AND ADVANCED CONCEPTS FOR EVENSTAR OPEN RADIO UNIT PLATFORM

    Contributor:
    Open Compute Project (OCP) Foundation, Bell, Massive Beams, Analogue Insight
    Family:
    Information
    Release Year:
    2025

  8. OPEN SYSTEMS FOR AI: BLUEPRINT FOR SCALABLE INFRASTRUCTURE

    Contributor:
    Open Compute Project (OCP) Foundation, Google, Intel, NVIDIA, Denvr Dataworks, Meta, Supermicro, AMD, Dell Inc. / Dell Technologies
    Family:
    Information
    Project:
    Strategic Initiatives > Open Systems for Artificial Intelligence
    Release Year:
    2025

  9. CHIPLET TEST DESIGN KIT (TDK)

    Contributor:
    Thrace Systems, Intel, Siemens
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025

  10. MATERIAL DESIGN KIT (MDK)

    Contributor:
    Thrace Systems, Siemens, Intel, Advanced Semiconductor Engineering, Inc, Cadence Design, Palo Alto Electron, Inc.
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025