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  1. WHITE PAPER: VISION AND ADVANCED CONCEPTS FOR EVENSTAR OPEN RADIO UNIT PLATFORM

    Contributor:
    Open Compute Project (OCP) Foundation, Bell, Massive Beams, Analogue Insight
    Family:
    Information
    Release Year:
    2025

  2. OPEN SYSTEMS FOR AI: BLUEPRINT FOR SCALABLE INFRASTRUCTURE

    Contributor:
    Open Compute Project (OCP) Foundation, Google, Intel, NVIDIA, Denvr Dataworks, Meta, Supermicro, AMD, Dell Inc. / Dell Technologies
    Family:
    Information
    Project:
    Strategic Initiatives > Open Systems for Artificial Intelligence
    Release Year:
    2025

  3. CHIPLET TEST DESIGN KIT (TDK)

    Contributor:
    Thrace Systems, Intel, Siemens
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025

  4. MATERIAL DESIGN KIT (MDK)

    Contributor:
    Thrace Systems, Siemens, Intel, Advanced Semiconductor Engineering, Inc, Cadence Design, Palo Alto Electron, Inc.
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025

  5. Assembly Design Kits (ADK)

    Contributor:
    Thrace Systems, Intel, Siemens, Advanced Semiconductor Engineering, Inc, Cadence Design, Palo Alto Electron, Inc.
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025

  6. GUIDELINES FOR IMPLEMENTING PASSIVE TECHNOLOGY COOLING SYSTEMS USING LOOP HEAT PIPE TECHNOLOGY

    Contributor:
    Neurok Thermocon, Calyos, Impleon
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025

  7. LIQUID TO LIQUID CDU TEST METHODOLOGY AND PERFORMANCE RATING

    Contributor:
    Intel, CoolIT Systems, Meta Green Cooling Technology, Wistron Corporation, Delta Solutions, Auras Technology, Kaori Thermal Technology, Supermicro, Cooler Master
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025

  8. HDD Dynamics Combined Acoustic & Vibration Surrogate White Paper

    Contributor:
    Western Digital, Dell Inc. / Dell Technologies, ZT Systems, IEIT Systems, Lenovo, Seagate
    Family:
    Storage
    Project:
    Storage
    Release Year:
    2024

  9. System in Package Testing

    Contributor:
    Tessolve Semiconductors Pvt. Ltd., Intel, Synopsys, Palo Alto Electron, Inc., Capgemini Engineering
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2024

  10. Sustainability Metrics Considerations – PUE

    Contributor:
    Intel, Microsoft
    Family:
    OTHER
    Project:
    Sustainability
    Release Year:
    2024