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  1. Data Center Facility – Low Voltage Direct Current Power Distribution

    Contributor:
    ABB, AEI – Advanced Energy, AMD, Analog Devices Inc, Amazon, Cyient Semiconductor, Danfoss, Eaton, Google, Heron Power, Littelfuse, Microsoft, North American Electric Reliability (NERC), nLevel, NVIDIA, OmniOn Power, Phoenix Contact, Rittal, Schneider Electric, Siemens, Tokamak Energy, Veir, Velankani Electronics & Automotive, Vertiv
    Family:
    Information
    Project:
    Data Center Facility > Power Distribution
    Release Year:
    2026

  2. GUIDELINES: Impact of Strategies on Data Center Energy Consumption, Carbon Footprint, and Water Consumption

    Contributor:
    Villanova University, AQ Compute Services Germany GmbH, Castrol Lmtd (BP), Google, General Services Administration (GSA), Liquidcool Solutions, Submer
    Family:
    Information
    Project:
    Data Center Facility
    Release Year:
    2026

  3. Guidelines for Using Dielectric Heat Transfer Fluids in Two- Phase Cold Plate-Based Liquid-Cooled Racks V1.1.0

    Contributor:
    ZutaCore, ChemTreat
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2026

  4. CONSIDERATIONS FOR SHIPPING AND STORAGE OF 1-PHASE COLD PLATE LIQUID COOLED RACKS AND SERVERS

    Contributor:
    Meta, NVIDIA
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2026

  5. WHITE PAPER: POWER ARCHITECTURE EVOLUTION IN DATA CENTERS

    Contributor:
    Renesas Electronics
    Family:
    Information
    Project:
    Rack & Power
    Release Year:
    2026

  6. Usage Guide for Service Baseline v1.0.0

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, Vertiv
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2026

  7. Usage Guide for Ethernet NIC v1.0.0

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, Vertiv
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2026

  8. Usage Guide for Baseline v1.1.0

    Contributor:
    Intel, Dell Inc. / Dell Technologies, HPE, Vertiv
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2026

  9. Open Cluster of N xPUs (XOC-N) System Architecture

    Contributor:
    Broadcom Inc., Celestica, SYSTEM-STACK
    Family:
    Information
    Project:
    Strategic Initiatives > Open Cluster Designs for Artificial Intelligence
    Release Year:
    2026

  10. Open Pod Group for M xPUs (OPG-M) System Architecture

    Contributor:
    Broadcom Inc., Celestica, SYSTEM-STACK
    Family:
    Information
    Project:
    Strategic Initiatives > Open Cluster Designs for Artificial Intelligence
    Release Year:
    2026