White Paper

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  1. THIRD PARTY INTEGRATION, TELEMETRY & APIS

    Contributor:
    Google, Microsoft, Oracle, NVIDIA
    Family:
    Information
    Project:
    Data Center Facility
    Release Year:
    2025

  2. FPGA-BASED PESTI MUX WITH INTEGRATED SNOOPER

    Contributor:
    HPE
    Family:
    Information
    Project:
    Server
    Release Year:
    2025

  3. White Paper: Near Data Computing, Present & Future

    Contributor:
    AMD, Arm, Marvell, Samsung Electronics, SKhynix, Solidigm
    Family:
    Information
    Project:
    Future Technologies Initiative > Data Centric Computing
    Release Year:
    2025

  4. White Paper: Using Data Poisoning to Contain and Recover from Uncorrected Errors

    Contributor:
    Microsoft, AMD, Arm, Cisco, Habana Labs
    Family:
    HW Management
    Project:
    Hardware Management > Hardware Fault Management
    Release Year:
    2025

  5. OCP FAULT MANAGEMENT INFRASTRUCTURE REQUIREMENTS version 1.5.0

    Contributor:
    Microsoft, Ampere Computing, AMD, Arm, Cisco, Dell Inc. / Dell Technologies, Google, Intel, Meta, Micron Technology, Oracle, SKhynix, SYSTEM-STACK
    Family:
    HW Management
    Project:
    Hardware Management > Hardware Fault Management
    Release Year:
    2025

  6. OCP FMFM (Fleet Memory Fault Management) Framework Requirements

    Contributor:
    Microsoft, AMD, Cisco, Dell Inc. / Dell Technologies, Intel, Meta, SKhynix, Google, Micron Technology, Samsung Electronics
    Family:
    HW Management
    Project:
    Hardware Management > Hardware Fault Management
    Release Year:
    2025

  7. Silent Data Corruption in AI Whitepaper v1.0

    Contributor:
    NVIDIA, Meta, Google, AMD, Intel, Arm, Microsoft
    Family:
    Information
    Project:
    Server
    Release Year:
    2025

  8. GUIDELINES FOR PRE-COMMISSION PREPARATION OF TECHNOLOGY COOLING SYSTEM (TCS) ROW MANIFOLDS IN LIQUID COOLED DATA CENTERS

    Contributor:
    NVIDIA, Nalco Water
    Family:
    Information
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025

  9. Reference Designs for Data Center Heat Reuse

    Contributor:
    Open Compute Project (OCP) Foundation
    Family:
    Data Center
    Project:
    Cooling Environments > Heat Reuse
    Release Year:
    2025

  10. 2P REFRIGERANT-BASED DIRECT LIQUID COOLING (DLC) TECHNOLOGY FOR NEXT GENERATION AI CLUSTERS WITH HIGH TDP ACCELERATORS

    Contributor:
    Intel, Vertiv, Parker-Hannifin, Accelsius
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2025