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  1. GUIDE TO INTEGRATION WORKFLOWS FOR HETEROGENEOUS CHIPLET SYSTEMS

    Contributor:
    Intel, Applied Materials, Advanced Semiconductor Engineering, Inc, Siemens, Palo Alto Electron, Inc.
    Family:
    Information
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2024

  2. Data Center Liquid Distribution Guidance & Reference Designs

    Contributor:
    Open Compute Project (OCP) Foundation, Victaulic, Vertiv, Microsoft, Green Revolution Cooling, Google, Intel, CEJN, Alfa Laval, Nalco Water, CoolIT Systems, Iceotope Technologies, Aligned Data Centers, Global Switch, LiquidStack Inc., Kao Data, PCX, Rittal, Meta, Promersion, Burns & McDonnell Engineering Company, Inc.
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2024

  3. DIELECTRIC COLD PLATE MODULAR DATA CENTER WHITE PAPER

    Contributor:
    ZutaCore, Wooden Datacenter
    Family:
    OTHER
    Project:
    Data Center Facility > Modular Data Center
    Release Year:
    2024

  4. Rack Manifold Requirements and Qualification Guideline

    Contributor:
    Intel, CoolIT Systems, Ingrasys Technology Inc., Inventec, Wistron Corporation, Delta Solutions, Chia Cherne, Jabil Inc., CEJN, Supermicro, Meta Green Cooling Technology, Southco, Inc.
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2023

  5. CMS: Logical System Architecture

    Contributor:
    Intel, Meta, Uber
    Family:
    Server
    Project:
    Server > Composable Memory System
    Release Year:
    2023

  6. CMS: Hotness Tracking Requirements

    Contributor:
    Microsoft, NVIDIA
    Family:
    Server
    Project:
    Server > Composable Memory System
    Release Year:
    2023

  7. CMS: End User Use Cases

    Contributor:
    Meta, Microsoft, Uber
    Family:
    Server
    Project:
    Server > Composable Memory System
    Release Year:
    2023

  8. CMS WORKLOADS AND BENCHMARKS

    Contributor:
    Meta, Uber, Intel
    Family:
    Server
    Project:
    Server > Composable Memory System
    Release Year:
    2023

  9. COLD PLATE COOLING LOOP REQUIREMENTS REV 2

    Contributor:
    CoolIT Systems, Boyd, Calyos, Intel, Meta, Parker-Hannifin, Stäubli Fluid Connectors, Vertiv, Veolia Water Technologies & Solutions, Motivair Corporation, Dell Inc. / Dell Technologies
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2023

  10. EVALUATING THE LIMITS OF DOOR HEAT EXCHANGER SOLUTIONS OPTIMIZED FOR OPEN RACK V3

    Contributor:
    Meta, Rittal, Amphenol, nVent, Boyd
    Family:
    OpenRack v3
    Project:
    Cooling Environments
    Release Year:
    2023