IT Infrastructure

Synopsys Platform Architect for Multi-Die is a SystemC™ standards-based performance and power analysis tool for early architecture exploration of multi-die designs. It accounts for the interdependencies between multiple dies (also referred to as chiplets) within multi-die…

Synopsys offers a complete HBM IP solution, including controller, PHY and verification IP, to meet the essential high-bandwidth and low-power memory requirements of system-on-chip (SoC) designs targeting high-performance computing, AI and graphics applications. The IP, supporting…

YorChip is interested in the co-development of Chiplets. YorChip provides PHY and partners can add IP.

Synopsys 3DIO Platform is a specialized IO for multi-die integration. It offers versatile solutions for system-on-chip (SoC) designers to implement tunable, integrated multi-die design structures targeting HPC (AI), GPU, CPU, and mobile applications. The optimal area…

Analog Devices, Inc. (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements…

Achronix Speedcore eFPGA IP is an advanced embedded FPGA technology engineered for seamless integration into custom ASICs and SoCs, particularly within chiplet architectures. Speedcore eFPGA IP provides unmatched flexibility, enabling on-chip reconfigurability to adapt to evolving…

Welcome to the Chiplet.US Catalog by Palo Alto Electron. Explore our extensive range of cutting-edge chiplets and heterogeneous components designed to meet the demands of modern semiconductor technology. Our catalog offers advanced chiplets as well as…

Discover the future of semiconductor technology with Palo Alto Electron’s Chiplet Integration and Package design and bring-up services. We offer package architecture, D2D physical and bump selection, standard vs advanced package trade-off, and a one-stop shop…

We offer advanced electronic design automation tools and services to address complex thermal, cooling, bump planning, and power optimization challenges in multi-die systems at silicon, package, and board levels. Utilizing fast simulator technology combined with AI-based…

Chiplet.US Alliance excels in advanced package manufacturing and testing capabilities, specializing in the integration and quality assurance of chiplet-based systems. With state-of-the-art facilities in the US and cutting-edge technology, Chiplet.US delivers high-performance solutions tailored to meet…