IT Infrastructure

Portwell OCP NIC 3.0 Network Module with 4x10GbE SFP+ Ports. Key features: Product Information: Contribution Information: Product Information

The Flex Secure Control Module (SCM) provides common server management, security, and control functions in a horizontal form factor module. The Flex SCM202A supports DC-MHS Host Processor Module (HPM) implementations supporting DC-SCI 2.0 pins (Data Center-Ready…

Unrivaled Performance and Reliability Powerful, reliable, and 2x faster than PCIe 4.0. Optimize performance of data-intensive, mission critical applications. Dual port operation expands availability in the event of a failure, with dedicated technical support. With 48% increased…

The scope of this document has several levels. The specification of the BoW interface includes these requirements: The specification includes recommendations for these elements: Bunch of Wires (BOW) R1 Specification

The diPort controller(diPort)isintended to provide a scalable chipletinterface controllerfor use with IOcoherent accelerators. diPortisintended to add runtime processor communication and signaling between two die via designated serial and parallel interface protocols. DiPortis optimized for die-to-die communications…

The ODSA OpenHBI or Open High Bandwidth Interface specification defines a high-performance die-todie or chiplet-to-chiplet interconnect on a medium such as a silicon interposer or equivalent technology in a common package. The OpenHBI defines an optimized…

Chiplet Design Exchange (CDX) Workstream of ODSA focuses on electrical, mechanical, and thermal design exchange standards related to chiplets and integration in the context of multi chiplet modules, 2.5D and 3D Integrated Circuits (IC). This initial…

Business and End user workgroups within ODSA are focused on solving business challenges to enable robust and open chiplet marketplace. This whitepaper summarizes some of the key activities within these groups that have identified challenges and…

Chiplet-based design is reshaping the way we build semiconductor systems with the promise to develop products cheaper, at lower unit cost and with faster time to market. These benefits and reports of success stories from big…

The field of heterogeneous chiplet systems, particularly in advanced packaging, has seen significant growth and interest recently. This surge is driven by the evolution of chiplet design and packaging manufacturing, which offers innovative solutions to overcome…