We offer advanced electronic design automation tools and services to address complex thermal, cooling, bump planning, and power optimization challenges in multi-die systems at silicon, package, and board levels. Utilizing fast simulator technology combined with AI-based input APIs, we enable rapid what-if analysis, allowing architects to make optimal thermal power-performance-cost design decisions early in the process.
Chiplet.US 3D-IC and Thermal Analysis
Solution Providers
Chiplet.US Alliance
Product Details
Solution Providers
Murata Front-End Power Supply Module (MWOCP67-5500-B-RM)
MWOCP67-5500-B-RM is a highly efficient (peak 97.5%), ORV3 5,500 W front-end power supply module featuring a 50.0 Vdc main output. The 50.0 V main output provides active current sharing together with output droop control for up…
Novatek AI ASIC & Chiplet Design Services
Novatek provides End to End Design Services from Spec-In / RTL-In / Netlist-In to GDS-In. And has built an Arm Neoverse Compute Subsystems (CSS) N2-based SoC as part of the Arm Total Design program, advancing innovation…