Contributions

Welcome to the OCP Contributions Database. All contributions listed here have undergone a comprehensive validation process and are available for you to utilize in your own infrastructure. See what you can learn from these contributions, build on their expertise, share your experiences and give back to the Community. Join in the movement and contribute today!
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Showing 1–12 of 941 contributions

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  1. Mt. Diablo Disaggregated Power Rack Specification V1.0.0

    Contributor:
    Meta, Google, Microsoft
    Family:
    OpenRack
    Project:
    Rack & Power
    Release Year:
    2026

  2. AI Native Edge-MHS V1.0.0 3D Design Files

    Contributor:
    HPE, AMD, Dell Inc. / Dell Technologies, Jabil Inc., New H3C Information Technologies, Intel Technologies
    Family:
    AI Computing Continuum
    Project:
    AI Computing Continuum > AI Native Edge MHS
    Primary Contribution:
    AI Native Edge-MHS Base Specification V1.0.0
    Release Year:
    2026

  3. AI Native Edge-MHS Base Specification V1.0.0

    Contributor:
    HPE, AMD, Intel, Dell Inc. / Dell Technologies, Jabil Inc., New H3C Information Technologies
    Project:
    AI Computing Continuum > AI Native Edge MHS
    Supporting Contributions:
    Release Year:
    2026

  4. RAS API Specification V0.96.0

    Contributor:
    HPE, AMD, Meta, Google, Intel, Microsoft, Arm, Qualcomm, Ampere Computing, NVIDIA, Synopsys, ByteDance Technology, Oracle, Everpure
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2026

  5. OCP Ready™ v1 Site Assessment, QScale Q01

    Contributor:
    QScale
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026

  6. OCP Ready™ v2 for Hyperscale Data Center Site Assessment, Princeton Digital Group MU1 DC2 India

    Contributor:
    Princeton Digital Group
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026

  7. OCP Ready™ v2 for Hyperscale Data Center Site Assessment, Princeton Digital Group MU1 DC1 India

    Contributor:
    Princeton Digital Group
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026

  8. White Paper | Fast-Switching OCS: Benefits, Technologies, System-Level Considerations, and Emerging Applications for Dynamic AI Fabrics

    Contributor:
    AMD, Intel, Ciena, iPronics, Lumentum, Triple-Stone Technology, Lumotive Inc.
    Family:
    Information
    Project:
    Networking > Optical Circuit Switching
    Release Year:
    2026

  9. OCP MicroXcaling (MX) Specification V1.1.0

    Contributor:
    AMD, Meta, Google, Intel, Microsoft, Arm, Qualcomm, NVIDIA
    Family:
    Server
    Project:
    Server
    Release Year:
    2026

  10. Foundation Chiplet System Architecture (FCSA) V1.1.0

    Contributor:
    Arm, SECURE-IC
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2026

  11. White Paper: Thermal Boundaries in AI Infrastructure

    Contributor:
    Meta, Oracle, Promersion
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2026

  12. Transparent Remote Optical Transceiver Messaging with ePPS Design Specification V0.9.0

    Contributor:
    Credo Technology
    Family:
    Networking
    Project:
    Networking > Optics Reliability
    Release Year:
    2026