IT Infrastructure

2U2N 1-Socket, OCP Compliant, High Flexibility Multi-Node Server Per Node ⦁  Single Intel® Xeon® 6900P Series Processor, TDP up to 500W ⦁  12 x DDR5 DIMM slots, up to 6400MT/s ⦁  8 x E1.S NVMe ⦁…

The MBH02-1A1SP5 HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A335 (210 x 335 x 1.93mm) ⦁  1-Socket LGA6096 (SP5), support AMD EPYC™ 9005…

The MBH00-1T1SP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A305 (210 x 305 x 1.93mm) ⦁  1-Socket LGA4710, support Intel® Xeon® 6700/6500-series processor…

The MBH01-1T1AP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A335 (210 x 335 x 2.36mm) ⦁  1-Socket LGA7529, support Intel® Xeon® 6900-series processor…

Novatek provides End to End Design Services from Spec-In / RTL-In / Netlist-In to GDS-In. And has built an Arm Neoverse Compute Subsystems (CSS) N2-based SoC as part of the Arm Total Design program, advancing innovation…

As a Leading System-Level Design Services Provider, VIA NEXT brings extensive expertise in system integration and chip design, delivering complete end-to-end solutions including SoC architecture to engineering validation board (EVB), and chip probe (CP) to system-level…

Insyde Software, an industry leader in system firmware and engineering services, brings its deep expertise to the OCP Chiplet Marketplace with insydeICE™, a developer-focused enablement program designed to accelerate Arm Neoverse CSS-based chiplet designs. insydeICE™ provides:…

Since its debut as the industry’s first UEFI BIOS in production, InsydeH2O® has been at the forefront of platform innovation—continuously evolving to support the latest industry standards and emerging platform technologies. Through collaboration with partners in…

The AMI® Developer Program for Arm® Total Design (ATD) provides early access to essential firmware and tools to accelerate custom silicon development based on Arm Neoverse® Compute Subsystem (CSS) chiplet architecture. Tailored for ATD ecosystem partners,…

The OCP Cooling Environments Project Total Cost of Ownership (TCO) tool rev1.31 helps serve the mission and purpose of the Open Compute Project Cooling Environment TCO Workstream to empower users with open, unbiased, peer reviewed, transparent tools to help make more…