As a Leading System-Level Design Services Provider, VIA NEXT brings extensive expertise in system integration and chip design, delivering complete end-to-end solutions including SoC architecture to engineering validation board (EVB), and chip probe (CP) to system-level testing (SLT), supporting client innovation from concept to mass production.
With Proven Experience in Complex Chiplet Integration, VIA NEXT has successfully executed multiple heterogeneous integration projects leveraging chiplet methodologies. Its experience with the Arm Chiplet System Architecture (CSA) allows VIA NEXT to deliver modular, scalable, and high-performance solutions tailored to the evolving demands of semiconductor innovation.
By joining the Arm Total Design ecosystem, VIA NEXT is well-positioned to accelerate the deployment of advanced AI and HPC solutions through chiplet-based architectures and next-generation system integration.
