The MBH01-1T1AP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center.
⦁ M-SDNO Class A335 (210 x 335 x 2.36mm)
⦁ 1-Socket LGA7529, support Intel® Xeon® 6900-series processor
⦁ 12 DIMM slots (1DPC), supports DDR5 RDIMM up to 6400MT/s, MCRDIMM up to 8800MT/s
⦁ 4 MCIO (PCIe5.0 x8) connectors, support CXL
⦁ 2 Multi-Trak connectors (PCIe5.0 x16) for PCIe riser, support CXL
⦁ 1 GenZ 1C connector (PCIe5.0 x4)
⦁ 1 x OCP 3.0 NIC (PCIe5.0 x16)
⦁ 1 x DC-SCI connector (PCIe5.0 x4) for DC-SCM2.0 module
