IT Infrastructure

The Micron 9550 NVMe™ SSD leads competitors as the world’s fastest SSD for data center storage. Built to manage critical workloads requiring extreme speed, scalability, and power efficiency such as AI, performance-focused databases, caching, online transaction…

Hyve Orion is ready to deploy rack-ready platform optimized for AI infrastructure and workloads featuring exceptional scalability, flexibility, and modularity Hyve Orion JBOG (“just a bunch of GPUs”): This GPU powerhouse is ideal for AI training, data…

Nebius 2OU Scalable ServerAMD EPYC™ 4th Gen server processors The Nebius 2OU Scalable Server is designed to achieve high power and thermal efficiency, as well as flexibility in server configuration for various purposes. It enables optimal…

Key to the decision making on chiplets is whether they make economic sense, which is scenario dependent. There are so many factors to consider and it is sometimes not obvious when and why it makes sense…

Murata high-density silicon capacitors have been developed with a semiconductor MOS process and are using 3D structures to substantially increase the electrode surfaces, and therefore increase the capacitance for a given footprint. Murata silicon technology is…

The Integrated Package Solution (iPaS™) is a board product with built-in and integrated components such as capacitors and inductors. It is possible to customize the internal component specifications and board layout according to your needs. In…

Sanmina’s Advanced Microsystems Technologies (AMT) division delivers comprehensive chip-to-product solutions, empowering industry leaders to bring their cutting-edge products to market. Our strategically located factories in North America and Thailand provide a trusted manufacturing foundation for these…

In today’s accelerating technology evolution driven by Datacenter demands and AI, you need to work with a partner that can design and implement advanced packaging solutions that push device architectures and process implementation for demanding market…

Design your next 3D-IC with DankaChiplet(TM) Platform. Built on industry standards, such as IEEE2416 and CDXML, DankaChiplet enables you to quickly architect your next 3D-IC by exploring power analysis, bump planing, and substrate and interposer connectivity…

Murata offers the No. 1 most abundant lineup in the industry, responding to all possible needs, and proposing ideal solutions. Continuing to evolve as the world’s No.1 manufacturer of ceramic capacitor. Murata conducts a total PDN…