In today’s accelerating technology evolution driven by Datacenter demands and AI, you need to work with a partner that can design and implement advanced packaging solutions that push device architectures and process implementation for demanding market applications.
With Sanmina’s Advanced Microsystems Technologies (AMT), you can leverage our significant experience in chiplet packaging through to full subsystem design and implementation in volume. Our expert design services encompass high-speed digital, RF, and optical systems, underpinned with innovative process and test development, that leverage our learning in diverse markets (including AI and Datacenter, Automotive Lidar to Quantum Computing) to hone a solution that works for you. We are committed to optimizing your chip designs to enable product solutions that will scale for high-volume manufacturing, while ensuring exceptional performance.
Work with us and leverage our expertise in:
Advanced high-performance substrate design
Heterogeneous integration
High-Speed Digital system design
Active Optical device packaging
Process Development and optimization
Rapid prototyping and verification
Production Functional Test
And you will share in an effective and efficient transition of your product from design to production within Sanmina’s cutting-edge manufacturing facilities.
FROM “WAFERS-IN TO SYSTEMS-OUT”
