Contributions

Welcome to the OCP Contributions Database. All contributions listed here have undergone a comprehensive validation process and are available for you to utilize in your own infrastructure. See what you can learn from these contributions, build on their expertise, share your experiences and give back to the Community. Join in the movement and contribute today!
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Showing 1–12 of 934 contributions

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  1. White Paper | Fast-Switching OCS: Benefits, Technologies, System-Level Considerations, and Emerging Applications for Dynamic AI Fabrics

    Contributor:
    AMD, Intel, Ciena, iPronics, Lumentum, Triple-Stone Technology, Lumotive Inc.
    Family:
    Information
    Project:
    Networking > Optical Circuit Switching
    Release Year:
    2026

  2. OCP MicroXcaling (MX) Specification V1.1.0

    Contributor:
    AMD, Meta, Google, Intel, Microsoft, Arm, Qualcomm, NVIDIA
    Family:
    Server
    Project:
    Server
    Release Year:
    2026

  3. Foundation Chiplet System Architecture (FCSA) V1.1.0

    Contributor:
    Arm, SECURE-IC
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2026

  4. White Paper: Thermal Boundaries in AI Infrastructure

    Contributor:
    Meta, Oracle, Promersion
    Family:
    Information
    Project:
    Cooling Environments
    Release Year:
    2026

  5. Transparent Remote Optical Transceiver Messaging with ePPS Design Specification V0.9.0

    Contributor:
    Credo Technology
    Family:
    Networking
    Project:
    Networking > Optics Reliability
    Release Year:
    2026

  6. Enhanced Telemetry Optics Product Software Specification V1.0.0

    Contributor:
    Credo Technology
    Family:
    Networking
    Project:
    Networking > Optics Reliability
    Release Year:
    2026

  7. White Paper: Time Synchronization in AI Distributed Infrastructure v0.9.1

    Contributor:
    Turba AI
    Family:
    Information
    Project:
    Time Appliances
    Release Year:
    2026

  8. MQD/MQDB V1.0.0 – Design Files

    Contributor:
    NVIDIA
    Family:
    Cooling Environments
    Project:
    Cooling Environments > Cold Plate
    Primary Contribution:
    MQD/MQDB OCP Design Specification V1.0.0
    Release Year:
    2026

  9. MQD/MQDB OCP Design Specification V1.0.0

    Contributor:
    NVIDIA
    Family:
    Cooling Environments
    Project:
    Cooling Environments > Cold Plate
    Supporting Contributions:
    Release Year:
    2026

  10. White Paper: Sustaining Multicast Continuity for Roaming 802.11ax Clients v0.11.1

    Contributor:
    Turba AI
    Family:
    Information
    Project:
    Time Appliances
    Release Year:
    2026

  11. Scale-Up Ethernet Transport (SUE-T) Base Specification v1.0.0

    Contributor:
    Arista Networks, Broadcom Inc.
    Family:
    Ethernet
    Project:
    Networking
    Release Year:
    2026

  12. Open Boot and Management Framework Interface Consolidation Protocol (OBMF-ICP) V1.0.0

    Contributor:
    AMD, Google, Intel, Microsoft, Dell Inc. / Dell Technologies, AMI, Arm, Marvell, NXP, NVIDIA, Renesas Electronics Corporation
    Project:
    Hardware Management
    Release Year:
    2026