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  1. Secure Firmware Recovery

    Contributor:
    Broadcom Inc.
    Family:
    Security
    Project:
    Security
    Release Year:
    2022

  2. Guidelines for Using Propylene Glycol Based Heat Transfer Fluids in Single Phase Cold Plate Based Liquid Cooled Racks

    Contributor:
    DOW Inc, Third Coast Chemicals, LLC, Meta, Intel
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2022

  3. Guidelines for Using Water-Based Transfer Fluids in Single-Phase Cold Plate-Based Liquid-Cooled Racks

    Contributor:
    Nalco Water, Meta, Intel, Neurok Thermocon
    Family:
    ACS
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2022

  4. Data Sanitization for the Circular Economy

    Contributor:
    Chia Network, Seagate, ITRenew (Iron Mountain), Western Digital, Sims Lifecycle Services
    Family:
    OTHER
    Project:
    Sustainability
    Release Year:
    2022

  5. PROPOSED STANDARDIZATION OF CHIPLET MODELS FOR HETEROGENEOUS INTEGRATION

    Contributor:
    Neurok Thermocon, Meta, Google, Arm, Siemens, Intel, Advanced Semiconductor Engineering, Inc, Applied Materials
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2022

  6. Operational Technology Security (OTS): Monitoring and Logging

    Contributor:
    Meta, Google
    Family:
    Data Center
    Release Year:
    2022

  7. OCP ReadyTM Data Centers – Program Mission, Methodology, and Case Studies

    Contributor:
    Open Compute Project (OCP) Foundation, Distech Controls, Kao Data, Maincubes B.V., Hydro66
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2022

  8. Guidelines for Connection of Liquid Cooled ITE to Data Center Facility Systems

    Contributor:
    Victaulic, Vertiv, J.M. Gross Engineering, LLC, Microsoft
    Family:
    Data Center
    Project:
    Cooling Environments > Coolant Distribution Unit
    Release Year:
    2022

  9. Developing an Open Chiplets Marketplace: Challenges and Opportunities

    Contributor:
    Arm, Google, IBM, JCET Group Co., Ltd., Meta, Microchip Technology, Inc., Samsung Electronics, Teradyne
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2022

  10. HARNESSING PROGRAMMABLE SWITCH SILICON USING NPL – PACKET BROKER USE CASE

    Contributor:
    NetScout Systems
    Family:
    OTHER
    Project:
    Networking
    Release Year:
    2022