Specification

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  1. OCP Microscaling Formats (MX) Specification

    Contributor:
    Microsoft, AMD, Arm, Intel, Meta, NVIDIA, Qualcomm
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2023

  2. Project Tahoe DC-SCM 2.0

    Contributor:
    Axiado
    Family:
    HW Management
    Project:
    Hardware Management
    Release Year:
    2023

  3. OCP Ready™ Site Assessment, Global Switch Amsterdam East Stage 1

    Contributor:
    Global Switch
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2023

  4. Grand Teton Switch Tray Specification

    Contributor:
    Meta
    Family:
    Server
    Project:
    Server
    Release Year:
    2023

  5. Grand Teton Platform Specification

    Contributor:
    Meta
    Family:
    Server
    Project:
    Server
    Release Year:
    2023

  6. Grand Teton Intel-Based CPU Tray Specification

    Contributor:
    Meta
    Family:
    Server
    Project:
    Server
    Release Year:
    2023

  7. Grand Teton AMD-Based CPU Tray Specification

    Contributor:
    Meta
    Family:
    Server
    Project:
    Server
    Release Year:
    2023

  8. 800G DDCv3 Base Spec

    Contributor:
    At & T, UfiSpace, Intel, DriveNets
    Family:
    Telco
    Project:
    Telco
    Release Year:
    2023

  9. Time Card Base Address via PCIe

    Contributor:
    NetTimeLogic
    Family:
    Software
    Project:
    Time Appliances
    Release Year:
    2023

  10. OCP NIC Core Features Base Specification

    Contributor:
    Google, Intel, Meta
    Family:
    Software
    Project:
    Networking
    Release Year:
    2023