Electronic Design Automation (EDA)

Control the thermal and stress impacts on your chiplets with Celsius Studio, the industry’s first unified AI-enabled multiphysics thermal platform that incorporates thermal, stress, and electronics cooling analysis.

Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a single data-model to integrate design, die-to-die routing, test and silicon lifecycle management, native system analysis,…

Synopsys Platform Architect for Multi-Die is a SystemC™ standards-based performance and power analysis tool for early architecture exploration of multi-die designs. It accounts for the interdependencies between multiple dies (also referred to as chiplets) within multi-die…

We offer advanced electronic design automation tools and services to address complex thermal, cooling, bump planning, and power optimization challenges in multi-die systems at silicon, package, and board levels. Utilizing fast simulator technology combined with AI-based…