Compute

4U 2-Socket, Direct-to-Chip Liquid Cooling NVIDIA HGX™ B200 8-GPU System Propelling The Data Center into A New Era of Accelerated Computing and Generative AI

8U 2-Socket NVIDIA HGX™ B200 8-GPU System Propelling The Data Center into A New Era of Accelerated Computing and Generative AI ⦁  NVIDIA HGX™ B200 8-GPU with NVIDIA NVSwitch™, 1.4TB HBM3e (8 x 180GB), TDP up…

4U 2-Socket, NVIDIA HGX™ B300 8-GPU, Built for the Age of AI Reasoning for Every Data Center ⦁  NVIDIA HGX™ B300 8-GPU, TDP up to 1100W ⦁  Dual Intel® Xeon® 6 processors, TDP up to 350W…

Overview Application

The MBH01-1T1AP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A335 (210 x 335 x 2.36mm) ⦁  1-Socket LGA7529, support Intel® Xeon® 6900-series processor…

2U2N 1-Socket, OCP Compliant, High Flexibility Multi-Node Server Per Node ⦁  Single Intel® Xeon® 6900P Series Processor, TDP up to 500W ⦁  12 x DDR5 DIMM slots, up to 6400MT/s ⦁  1 x PCIe 5.0 x16…

2U2N 1-Socket, OCP Compliant, High Flexibility Multi-Node Server Per Node ⦁  Single Intel® Xeon® 6900P Series Processor, TDP up to 500W ⦁  12 x DDR5 DIMM slots, up to 6400MT/s ⦁  4 x E1.S NVMe ⦁…

2U2N 1-Socket, OCP Compliant, High Flexibility Multi-Node Server Per Node ⦁  Single Intel® Xeon® 6900P Series Processor, TDP up to 500W ⦁  12 x DDR5 DIMM slots, up to 6400MT/s ⦁  8 x E1.S NVMe ⦁…

The MBH02-1A1SP5 HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A335 (210 x 335 x 1.93mm) ⦁  1-Socket LGA6096 (SP5), support AMD EPYC™ 9005…

The MBH00-1T1SP HPM follows OCP DC-MHS specification to enable a common design for multi-node servers within modern data center. ⦁  M-SDNO Class A305 (210 x 305 x 1.93mm) ⦁  1-Socket LGA4710, support Intel® Xeon® 6700/6500-series processor…