Contributions

Welcome to the OCP Contributions Database. All contributions listed here have undergone a comprehensive validation process and are available for you to utilize in your own infrastructure. See what you can learn from these contributions, build on their expertise, share your experiences and give back to the Community. Join in the movement and contribute today!
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Showing 1–12 of 918 contributions

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  1. Guidelines for Using Propylene Glycol-Based Heat Transfer Fluids in Liquid Cooling Racks

    Contributor:
    DOW Inc, Castrol Lmtd (BP), PFX Group, Cool Filtration, Faradaic Enterprises
    Family:
    Information
    Project:
    Cooling Environments > Cold Plate
    Release Year:
    2026

  2. Open Data Center: Next-Generation ML Infrastructure Design Principles V0.7.0

    Contributor:
    AMD, Meta, Google, NVIDIA
    Family:
    Data Center
    Project:
    Data Center Facility
    Release Year:
    2026

  3. Data Center Facility – Low Voltage Direct Current Power Distribution V1.1.0

    Contributor:
    Alderbuck Energy, Inc., Sensata Technologies, Karman, Veir, Tokamak Energy, OmniOn Power, nLevel, EPC Power Corp, Cyient Semiconductor, North American Electric Reliability (NERC), Littelfuse, SolarEdge, Nybolt, Echion Technologies, MERSEN, Amazon Web Services (AWS), Dragon Q Energy, ABB Integrated DC Power, SPOC Energy, UL Solutions Inc., Analog Devices, AMD, Google, Microsoft, Schneider Electric, Rittal, AEI – Advanced Energy, Danfoss, Vertiv, TE Connectivity, Delta Electronics, NVIDIA, Phoenix Contact, Siemens, Eaton, Velankani Electronics & Automotive, Infineon Technologies, DG MATRiX, Heron Power, Atom Power
    Family:
    Information
    Project:
    Data Center Facility > Power Distribution
    Release Year:
    2026

  4. Interface Specification Between Hyperscalers and Utility Grid for Disturbance Performance V1.0.0

    Contributor:
    Meta, Google, Microsoft, NVIDIA
    Family:
    Data Center
    Project:
    Data Center Facility
    Release Year:
    2026

  5. Project Brazos

    Contributor:
    Google
    Family:
    Cooling Environments
    Project:
    Cooling Environments
    Release Year:
    2026

  6. BoW.Flexi V1.0.0

    Contributor:
    VeriSilicon Microelectronics, Microchip Technology, Inc., Eliyan Corporation, YorChip, Infineon Technologies
    Family:
    Server
    Project:
    Server > Open Chiplet Economy > Bunch of Wires
    Release Year:
    2026

  7. Universal Quick Disconnect (UQD) Specification V2.0.0

    Contributor:
    AMD
    Family:
    Cold Plate
    Project:
    Cooling Environments
    Release Year:
    2026

  8. Single-Phase Direct-to-Chip Cold Plate Test Specification V1.0.0

    Contributor:
    CoolIT Systems, PFX Group, INFICON, Fabric8Labs
    Family:
    Cold Plate
    Project:
    Cooling Environments
    Release Year:
    2026

  9. OCP S.A.F.E.™ PUFsecurity Corporation OCP S.A.F.E.™ and Caliptra Trademark Assessments

    Contributor:
    PUFsecurity Corporation
    Family:
    Security
    Project:
    Security > Security Appraisal Framework and Enablement
    Release Year:
    2026

  10. OCP Ready™ v2 for Hyperscale Data Center Site Assessment, Princeton Digital Group TY1 DC2 Japan

    Contributor:
    Princeton Digital Group
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026

  11. OCP Ready™ v2 for Hyperscale Data Center Site Assessment, Princeton Digital Group TY1 DC1 Japan

    Contributor:
    Princeton Digital Group
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026

  12. OCP Ready™ v2 for Hyperscale Data Center Site Assessment, Aligned Data Centers ATL01 – v1.0 rev1.15

    Contributor:
    Aligned Data Centers
    Family:
    Data Center
    Project:
    Data Center Facility > OCP Ready™ Data Center Recognition Program
    Release Year:
    2026