Specification

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  1. Plate Heat Exchanger Base Specification

    Contributor:
    Alfa Laval, Danfoss, Wieland
    Family:
    OTHER
    Project:
    Cooling Environments
    Release Year:
    2025

  2. Endurance Storage System

    Contributor:
    Jabil Inc.
    Family:
    Storage
    Project:
    Storage
    Release Year:
    2025

  3. NVMe™ Project OCP L.O.C.K.

    Contributor:
    Google, Microsoft, Samsung Electronics, KIOXIA, Solidigm
    Family:
    Storage
    Project:
    Storage
    Release Year:
    2025

  4. BoW Memory Addendum to the Bunch of Wires (BoW) PHY Specification

    Contributor:
    Eliyan Corporation
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025

  5. Caliptra: A Datacenter System on a Chip (SoC) Root of Trust (RoT)

    Contributor:
    Google, Microsoft, AMD, NVIDIA
    Family:
    Security
    Project:
    Security
    Release Year:
    2025

  6. Scale Up Ethernet (SUE)

    Contributor:
    Broadcom Inc.
    Family:
    OTHER
    Project:
    Networking
    Release Year:
    2025

  7. Project Deschutes: Data Center Facilities V.0.8.0

    Contributor:
    Google
    Family:
    Coolant Distribution Unit
    Project:
    Cooling Environments
    Supporting Contributions:
    Release Year:
    2025

  8. Datacenter SAS-SATA Device Specification v 1.5

    Contributor:
    Meta, HPE, Dell Inc. / Dell Technologies, Microsoft
    Family:
    Storage
    Project:
    Storage
    Release Year:
    2025

  9. Base Specification for Embodied Carbon Disclosure

    Contributor:
    Schneider Electric, Google, Microsoft, Meta
    Family:
    Information
    Project:
    Sustainability
    Release Year:
    2025

  10. Universal D2D Transaction and Link Layer Specification

    Contributor:
    Ventana Micro Systems Inc.
    Family:
    Server
    Project:
    Server > Open Chiplet Economy
    Release Year:
    2025