The Flex Modular Compute Platform provides a customizable, open standard-based server system that is designed for the most challenging AI-enabled and High-Performance Computing (HPC) applications. This platform complies with the Open Compute Project (OCP) DC-MHS 2.0 specification and features a Host Processor Module (HPM) that supports up to two Intel® Xeon® 6900 series processors.
- 2OU ORv3, rack-mount with front I/O
- OCP DC-MHS 2.0 specification compliant
- Rack-level power via 48v busbar
- Dimensions: 537.0(W) x 92.7(H) x 802.7(D) mm
- OCP Spec – DC-MHS 2.0
