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| Presenters (Company) | Title | Slides |
| John Stuewe (Dell) Mark Shaw (Microsoft): Server Project Co-leads |
– Mission and importance – Sub Projects – Workstreams |
Slides |
| Damien Chong (Meta): Mezz Sub-Project Lead Jason Rock (Dell) |
– OCP NIC 3.0 sub-project updates. – Plans for PCIe Gen6 and sidebands – OCP NIC Gen5 test fixtures |
Slides |
| Song Kok Hang(Intel) Bichen Chen (Meta) John Norton (Nvidia) Peter Chen (Enflame) |
– OAI High speed and system workstream update – Nvidia contributing HGX physical spec to OAI – Successful story from Enflame with OAI – First liquid-cooled OAI/OAM system in production |
|
| Allan Cante (NallasWay): HPC Sub-Project Lead | HPC sub-project update progress and projects with a request for additional participation | Slides |
| Bapi Vinnakota (Broadcom): ODSA Sub-Project Lead |
ODSA sub-project update |
Slides |
| Ketan Mehta (SiFive) Rishi Chugh (Cadence) |
ODSA sub-project: OpenHBI Products – OHBI PHY w/ Link Controller for OHBI/BoW – UltraLink and HBI PHY |
|
| Elad Alon (Blue Cheetah Analog) Kash Johal (eTopus) |
ODSA sub-project: BoW Products – BoW PHY’s – I/O chiplets with BOW PHY |
|
| Gary Miller (NXP) Jayaprakash Balachandran (Cisco) |
ODSA sub-project: Prototypes – NXP activities – BoW PHY Interoperability Test Package |
|
|
Brian Faith (Quicklogic) |
ODSA sub-project: IP and ASIC Products – I/O Chiplets – 400G SmartNIC Chiplets / BoW – 4th Generation SmartNic Using Chiplets and Die to Die Interconnect – Chiplet based AI Compute Platform using BOW PHY/Controller |
|
| John Stuewe (Dell) Mark Shaw (Microsoft): Server Project Co-leads |
Wrap up and next steps: – What can the Server Project do better? – Which communities should we collaborate with? – What areas should we focus on? |
* Disclaimer (2024 August) – The OCP Subproject formerly named Open Domain-Specific Architecture (ODSA) has been renamed to Open Chiplet Economy.