Module Interconnect
Module Interconnect is a Workstream under the High Performance Computing (HPC) Sub-Project of the OCP Server Project. The HPC Sub-Project serves the HPC, supercomputing, and high performance data analytics markets with open hardware platforms, focusing on modular, flexible, and composable heterogeneous multi-processor systems. Its workstreams support the High Performance Compute Module – Wall of Compute (HPCM-WoC) open computing architecture. Details about the workstream’s mission, scope, deliverables, and ways to get involved will be added in the near future.
About This Workstream
Module Interconnect is a Workstream under the High Performance Computing (HPC) Sub-Project of the OCP Server Project, listed on the HPC wiki as the HPCM Interconnect workstream.
The High Performance Computing Sub-Project serves the HPC, supercomputing, and high performance data analytics markets with open hardware platforms from system level down to silicon, focusing on modular, flexible, and composable heterogeneous multi-processor systems that scale to thousands of processors energy-efficiently.
The Sub-Project’s workstreams support its work on an open industry-standard computing architecture, the High Performance Compute Module – Wall of Compute (HPCM-WoC).
Learn more
The HPC Sub-Project’s documents, workstream mailing lists, and call recordings are on the OCP wiki.
Scope
The scope of this workstream will be added in the near future.