Door Heat Exchanger

The Door Heat Exchanger (DHX) Sub-Project, part of OCP's Cooling Environments effort, develops, integrates, and standardizes Rear Door Heat Exchangers (RDHX) within the ORV3 Open Rack framework, using liquid cooling to manage the thermal load of high-density IT equipment. Key industry players collaborate on standardized interfaces, compatibility with existing infrastructure, and risk mitigation, publishing guidelines and specifications through white papers and presentations. Current workstreams cover RDHX interfaces for ORV3, aluminum heat exchanger integration, and air-assisted liquid cooling with sidecar units. The scope spans fluid compatibility, operational parameters, heat extraction metrics, system integration, and interface standardization for reliable, energy-efficient data center cooling.

Door Heat Exchanger

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Steering Committee Representative

Steve Mills

About This Sub-Project


The Door Heat Exchanger (DHX) Sub-Project is a critical component of the Open Compute Project’s (OCP) broader effort to standardize advanced cooling solutions in data centers, particularly in high-performance computing environments. This sub-project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. RDHX systems are designed to enhance cooling efficiency by utilizing liquid cooling technology to manage the thermal load of high-density IT equipment, thereby improving energy efficiency and operational reliability in modern data centers.

The ongoing work in this project involves collaboration between key industry players. These organizations are working together to address various challenges associated with RDHX implementation, including the development of standardized interfaces, ensuring compatibility with existing data center infrastructure, and mitigating risks such as fluid leaks and equipment failure. The project aims to produce comprehensive guidelines and specifications that will be shared through white papers and industry presentations, helping to drive the adoption of RDHX systems across the industry.

Summary of Current Workstreams

1. RDHX Interfaces for ORV3

This workstream focuses on defining the mechanical, fluid, and electrical interfaces required for integrating RDHX systems with ORV3 racks. The effort addresses challenges such as ensuring compatibility with existing rack designs, preventing fluid leaks, and maintaining system reliability. The outcomes of this workstream include the standardization of interfaces to support various configurations, including hybrid systems that combine liquid and air cooling.

2. Aluminum Heat Exchanger Integration

Led by a collaboration between OVHCloud, Meta, and Valeo, this workstream aims to overcome the challenges associated with using aluminum in heat exchangers, particularly the risk of corrosion. The team is developing standards for internal linings, coatings, and compatible coolants to enhance the performance and durability of aluminum heat exchangers in data center environments. This workstream will produce guidelines that address integration techniques, testing methodologies, and recommendations for widespread adoption.

3. Air-Assisted Liquid Cooling (AALC) with Sidecar Cooling

This workstream explores the implementation of Air-Assisted Liquid Cooling (AALC) systems, which combine the efficiency of liquid cooling with the simplicity of air cooling. The focus is on developing sidecar units that attach to or are positioned adjacent to the IT racks, providing flexible and scalable cooling solutions without the need for access to facility water. The team is working on standardizing performance metrics, interface designs, and ensuring the maintainability and reliability of these systems in various data center configurations.

Scope

The scope of the Door Heat Exchanger Sub-Project is focused on several key areas that are essential for the successful deployment and integration of RDHX systems within data centers. These include:

Fluid Characteristics and Compatibility — defining the types of fluids and their properties suitable for use in RDHX systems, ensuring compatibility with existing data center cooling infrastructure and optimizing heat transfer efficiency
Operational Parameters — establishing guidelines for the operating conditions of RDHX systems, including temperature ranges, flow rates, and pressure levels, to ensure reliable performance across various data center environments
Heat Extraction Metrics — developing standardized methods for measuring the effectiveness of RDHX systems in extracting heat, critical for assessing system performance and energy efficiency
System Integration — creating solutions that allow RDHX systems to be integrated seamlessly into both traditional and modern data center environments, whether they use air cooling, liquid cooling, or hybrid systems
Interface Standardization — standardizing the mechanical, fluid, and electrical interfaces required for RDHX systems to function effectively with ORV3 racks and other components, facilitating easier deployment and maintenance

Out of Scope

This project does not cover detailed installation methods for cold plates or the broader definitions of data center facility loops beyond the direct rack interfaces. The focus remains on rack-level integration and the specific challenges related to RDHX systems.

This sub-project is crucial for advancing the adoption of liquid cooling technologies within the data center industry. By focusing on standardization and the development of robust guidelines, the project aims to ensure that RDHX systems are not only effective but also widely compatible with various data center configurations, supporting the industry’s move towards more sustainable and efficient cooling solutions.

Resources

Welcome to the OCP Door Heat Exchanger Sub-Project.

This Project is open to the public and we welcome all those who would like to be involved.

The Door Heat Exchanger (DHX) Sub-Project is a critical component of the Open Compute Project’s (OCP) broader effort to standardize advanced cooling solutions in data centers, particularly in high-performance computing environments. This sub-project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. RDHX systems are designed to enhance cooling efficiency by utilizing liquid cooling technology to manage the thermal load of high-density IT equipment, thereby improving energy efficiency and operational reliability in modern data centers.

The ongoing work in this project involves collaboration between key industry players . These organizations are working together to address various challenges associated with RDHX implementation, including the development of standardized interfaces, ensuring compatibility with existing data center infrastructure, and mitigating risks such as fluid leaks and equipment failure. The project aims to produce comprehensive guidelines and specifications that will be shared through white papers and industry presentations, helping to drive the adoption of RDHX systems across the industry.

Documents

– ACS Charter – Meeting Minutes (Working Doc) – OCP Presentation Template – please contact Michael Schill for a copy

ACS Door Heat Exchanger Workstream Work in Progress Documents

– ACS Door HEX Options Presentation – High-Power GPU Rack Concept presentation – Working OCP Specification – ACS Door Heat Exchanger Requirements Document for Open Rack Revision .95

Recordings from Past Calls

Recordings and notes not on YouTube

– June 6, 2024 – May 9, 2024 – March 28, 2024 – February 29, 2024 – February 15, 2024 – February 2, 2024 – January 18, 2024 – January 4, 2024 – November 10th, 2022 – October 23rd, 2022 – Notes from Oct 18 Call

Regular Project Calls

Every other Thursday from 09:00-10:00am PT/18:00-19:00 CET/00:00-01:00 CST.

Call link

– Link to ACS Door Heat Exchanger Workstream Calls

You can also dial in using your phone. United States (Toll Free): 1 866 899 4679 United States: +1 (669) 224-3318 Access Code: 600-541-373

Call Calendar

These meeting are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project’s wiki page and are open to the public in accordance to OCP’s Bylaws and IP Policy. This can be found at http://www.opencompute.org/about/ocp-policies/. If you have any questions please contact OCP. 

Door Heat Exchanger calendar


Sub-Projects


Advancing AALC Systems with Sidecar Cooling Solutions

Advancing AALC Systems with Sidecar Cooling Solutions is a workstream under the Door Heat Exchanger Sub-Project of the OCP Cooling Environments Project. The Door Heat Exchanger Sub-Project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. This workstream focuses on the implementation of Air-Assisted Liquid Cooling (AALC) systems, which combine the efficiency of liquid cooling with the simplicity of air cooling. Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.

Aluminum Heat Exchanger

Aluminum Heat Exchanger is a Workstream under the Door Heat Exchanger Sub-Project of the OCP Cooling Environments Project. The Door Heat Exchanger Sub-Project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.

Design Guidelines

Design Guidelines is a workstream under the Door Heat Exchanger Sub-Project of the OCP Cooling Environments Project. The Door Heat Exchanger Sub-Project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.

Specification Development

Specification Development is a workstream under the Door Heat Exchanger Sub-Project of the OCP Cooling Environments Project. The Door Heat Exchanger Sub-Project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.

TCS Flow Management

TCS Flow Management is a workstream under the Door Heat Exchanger Sub-Project of the OCP Cooling Environments Project. The Door Heat Exchanger Sub-Project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. Details about the workstream’s mission, leadership, and ways to get involved will be added in the near future.