The OCP Innovation Village is a shining example of OCP’s collaborative spirit! This dynamic space celebrates the groundbreaking work of our community members who are actively contributing to OCP Projects and shaping the future of open hardware.
Discover demonstrations from teams working on OCP Accepted™ and OCP Inspired™ innovations. Watch emerging specifications come to life, and connect with fellow contributors who are pushing the boundaries of open infrastructure. From early research to live hardware demonstrations, the Innovation Village offers a hands-on look at what’s next in compute, networking, storage, and data center infrastructure.
Make sure to visit these exciting areas and see the latest breakthroughs from the OCP Community!
DC Automation
- DS Automation – Data center robotics and automation systems designed for safer, more efficient operations.
- Jtec Automation – Robotics and automation technologies streamlining server handling and data center workflows.
- Meta – Robotics for Datacenters: demonstrating safety and efficiency improvements through robotics integration.
- Safeway – Automated material handling solutions that improve safety, speed, and efficiency in datacenter operations.
Open Systems for AI
- Broadcom Inc. – 200G Ethernet SerDes Technology: enabling high-speed data links optimized for AI clusters.
- Credo – Open networking and interconnect solutions for scalable AI workloads.
- Rittal LLC – 48” Rack Architecture: expanding physical design standards to support AI-driven density and performance requirements.
- META / Cejn / Parker Hannifin – Collaborative demonstrations of liquid cooling technologies, including quick-connect solutions and advanced fluid systems engineered for efficient, reliable cooling of AI infrastructure.
Composable Memory Systems (CMS)
- Micron Technologies – Fabric-attached shared/pooled CXL memory: a live demo showing how performance scales with memory pooling and the impact of composability on real workloads.
- Seagate – Composable Memory Appliance (CMA) Benchmark: hands-on demo of the Seagate CXL appliance, benchmarked with multiple servers and showcasing orchestration.
- JackRabbit Labs; SK Hynix – CMS orchestration with Niagara, DCD, and Redfish API: demonstrating integration and workload management in a composable memory environment.
- Elephance Memory / Aeon Computing – AI and Database use cases: CMS principles applied to accelerate database operations and AI workloads with large-scale pooled memory.
- Unifabrix – Large memory capacity demo: extending CMS to computational memory and offloading functions for greater performance and scalability.
- Samsung Semiconductor, Inc. – Memory pooling with virtualization: showcasing pooling with Qemu, FPGA, and open-source CMS orchestration tools.
- H3 Platform / Samsung – CXL 2.0 memory system demo: a 3U composable memory system supporting pooling and sharing at datacenter scale.
- XConn Technologies; MemVerge – AI workload demos with Gismo for memory pooling and sharing: optimizing AI performance using pooled memory architectures.
- Intel / Altera – CXL-Type2 acceleration (live): demonstrating acceleration features and in-memory database (IMDB) performance gains with pooled memory.
- ZeroPoint – Dynamic memory compression and tier adjustment: live workloads demonstrating real-time adjustment of composable memory tiers for efficiency and cost savings.
Server & NIC
- Broadcom Inc. – Scaling OCP NICs from 1G to 400G, showcasing advances in high-speed networking.
- Dell Technologies – Server platforms integrating OCP NIC 3.0 for enterprise and hyperscale deployments.
- Intel – Open Boot & Management Framework (OBMF) demonstrations.
- Meta – A showcase of OCP NIC 3.0 compliant servers and supporting platforms.
- Portwell – Server systems leveraging OCP NIC standards.
- Spirent Communications – Network Test Appliance demo for evaluating NIC performance and interoperability.
- Supermicro – Live demo resolving GPU bottlenecks with Turba, Intel, and Supermicro integration.
Time Appliances (TAP)
- Broadcom Inc. – PTP implementations delivering precise timing across data center systems.
- Calnex Solutions – Boundary Clock Time Accuracy Qualification.
- ENSCO – Open Time Server Cluster / Timing Rig demo.
- GuideTech – Multi-channel, sub-picosecond time measurement system.
- Intel – Ultra-low latency communications for timing-sensitive applications.
- Meinberg – High-accuracy timing solutions for synchronization.
- Meta – OCP TAP open-source boards on display.
- NICT Japan – Wireless precision synchronization demo.
- Rakon Ltd – OCXOs with Error Exchange Capabilities.
- Safran Electronics and Defense – Showcase of advanced timing products.
- SiTime – Synchronization oscillator platform.
- Supermicro – Integration of TAP technologies within server platforms.
Open Chiplet Economy
- YorChip Inc. – Modular AI chiplets for both edge and datacenter applications, enabling secure and scalable system-on-chip integration.
- Baya Systems – High-performance die-to-die interconnect IP and bridging solutions that power communication between chiplets.
- Palo Alto Electron – Chiplet integration and prototyping platforms, including physical 3DIC systems with thermal and signal integrity monitoring.
- Anemoi Software – AI-driven co-design and simulation workflow tools that accelerate chiplet development with digital twin modeling.
- Arm – Advancing open chiplet standards for compute and acceleration through ecosystem collaboration.
- ASE – Packaging innovations supporting chiplet-based architectures at scale.
- Eliyan – Die-to-die interconnect technologies enabling high-bandwidth chiplet communication.
- Alphawave Semi – Leading interconnect IP provider supporting open chiplet-based system integration.
Future Technologies Symposium / Tech Demos
- Lumotive – Metasurfaces for Optical Circuit Switching: using tunable nanostructures to dynamically steer optical paths and enable more flexible, scalable interconnects.
- HPE Juniper Networking – Quantum-safe VPNs with Crypto Agility: secure communications adaptable to both classical and post-quantum cryptography.
- CelLink Corporation – CelLink Power Plane Flex Circuit: flexible, multi-layer interconnects capable of routing high-current power in dense compute form factors.
- ZutaCore Ltd. – Two-phase Sidecar Cooling: a side-mounted system for efficiently cooling 8-GPU AI servers using liquid-to-vapor heat transfer.
- YPLASMA Actuators Technologies Inc. – Solid-State Fan: a plasma actuator–based cooling solution with no moving parts for quiet, durable electronic cooling.
- Cerabyte, Inc. – Ceramic-based storage technology designed for ultra-durable, long-term data preservation.
- Phasic Energy – Thermal AI Software and 1 MW Heat Exchanger: predictive AI-driven thermal modeling paired with a large-scale cooling prototype.
- Point2 Technology – e-Tube RF-over-Plastic: next-generation AI interconnect enabling high-bandwidth, low-loss signal transport over plastic waveguides.
- OmniOn Power (a subsidiary of AcBel Polytech) – Liquid-Cooled Rectifiers: compact power delivery modules with integrated liquid cooling for higher efficiency and density.
- Lux Semiconductors – Smart Metal™ Platform: open foundry substrates designed for scalable compute integration across memory, interconnect, and power layers.
Why Visit the Innovation Village?
- Hands-on discovery – See real demos from companies shaping the future of compute, networking, storage, and data centers.
- Collaborative innovation – Explore early-stage concepts that are evolving to meet market needs.
- Direct engagement – Meet the engineers and innovators driving these breakthroughs to learn and share your feedback.
The Innovation Village is open all hours that the Expo Hall is open. Be sure to stop by!