The 2026 OCP APAC Summit brought nearly 2,500 attendees of the global OCP Community together at TaiNEX2 in Taipei City, Taiwan, on August 11–12, making this year’s gathering a tremendous success and demonstrating the continued growth and importance of the OCP Community across the Asia Pacific region.
Thank you to our Members, Sponsors, Partners, Volunteers, Speakers and everyone across the Community who helped make the Summit possible!
Held under the theme “Leading the Future of AI,” this year’s Summit came at a pivotal moment for the data center industry. As AI drives unprecedented demand for compute capacity, power, cooling and connectivity, the OCP Community is working collaboratively across the entire IT infrastructure and data center facilities stack to develop more open, scalable, interoperable and sustainable solutions.
Content Highlights
Taiwan sits at the center of many of the technologies and supply chains that are enabling the rapid expansion of AI Data Centers. Bringing the OCP Community together in Taipei provided an important opportunity for technology leaders from across APAC and around the world to collaborate on the infrastructure challenges created by the next generation of AI.
Keynotes kicked off the event with amazing speakers from AMD, Applied Materials, Arm, ASE, Broadcom, Google, Microsoft, NTT Corporation, NVIDIA and TSMC.
The two-day technical program explored the technologies required to support AI technologies from grid to chip, with content organized across 11 major areas:
- Adoption of OCP-Recognized Equipment & Facilities
- AI Clusters
- AI Computing Continuum
- Chiplets & Advanced Packaging
- Cooling Environments
- Future Technologies Symposium
- Networking
- Open Data Center for AI: Rack & Power, Power Distribution and Facility Design
- Photonics
- Server
- Storage & Memory
The program reflected the expanding scope of the OCP Community’s work. Topics ranged from scale-in, scale-up, scale-out, and scale-across networking for AI clusters, chiplets and advanced packaging, photonics and high-bandwidth interconnects to direct liquid cooling, next-generation rack architectures, power distribution, storage, memory and data center facility design.
A particularly important focus was the AI Computing Continuum, which looks beyond traditional hyperscale data centers toward the infrastructure required as AI inference increasingly moves closer to where data is created and consumed. The OCP Community is developing open, modular infrastructure approaches that can support AI across regional colocation facilities, enterprise environments, telecommunications infrastructure and other distributed computing locations.
The Summit also featured the Future Technologies Symposium, bringing together researchers, academics, startups and industry experts examining technologies expected to influence AI, HPC and data center infrastructure over the next two to five years.
Two co-located workshops provided additional opportunities for technical collaboration.
The SONiC Foundation Workshop brought developers, users and collaborators together around advances and real-world deployments in open networking, while the SystemReady Workshop by Arm offered hands-on experience with platform validation and the SystemReady specification.
By the Numbers
The scale and diversity of this year’s event demonstrate the continued growth of the OCP Community across APAC.
2,453 registered participants
- 2,343 attendees checked in
- That represents a 95.5% check-in rate among registered participants
218 breakout-session speakers
More than 1,000 organizations from 36 countries represented
The event was both international and regional in scope:
- 86.3% of registrants came from the Asia Pacific region
- 10.7% came from North America
- 2.9% came from Europe, the Middle East and Africa
- Registrants from Latin America represented the remaining share
Taiwan was the largest participating market, representing 65.3% of registrations, followed by:
- United States: 242
- Japan: 155
- India: 77
- Singapore: 74
- China: 67
- South Korea: 67
- Malaysia: 26
- Germany: 23
- Hong Kong: 20
- Canada: 18
- Australia: 11
Participants also traveled from countries including Thailand, Israel, the United Kingdom, France, Italy, the Philippines, Sweden, Indonesia, Pakistan, Mexico, the Netherlands, Poland, Bangladesh, Belgium, Brazil, the Czech Republic, Kazakhstan, Lithuania, Mongolia, Nepal, Portugal, Slovakia and Spain.
The participation numbers represent significant growth from the previous year. The 2025 OCP APAC Summit attracted more than 1,500 attendees. With 2,453 registrations in 2026, this year’s event grew by more than 60% year over year, further demonstrating the rapidly expanding engagement of the APAC infrastructure community with OCP.
APAC’s Growing Role in Open AI Infrastructure
The growth of the OCP APAC Summit reflects a larger shift taking place across the technology industry.
AI is requiring the industry to rethink nearly every part of the data center, including compute architectures, networking, power distribution, cooling, storage, memory, silicon and even the relationship between the data center and the electrical grid.
Many of the companies designing and manufacturing these technologies have a major presence across the Asia Pacific region. That makes collaboration within the APAC OCP Community increasingly important not only regionally, but globally.
The 2026 OCP APAC Summit demonstrated what is possible when hyperscalers, semiconductor companies, equipment manufacturers, data center operators, researchers, suppliers and technology innovators come together in an open environment to solve shared infrastructure challenges.
As AI infrastructure continues to scale, that collaboration will become even more important.
Thank you again to our sponsors, speakers, volunteers, partners and the entire OCP Community for helping make the 2026 OCP APAC Summit such a success.
The photos from the event can be found here: https://www.flickr.com/photos/opencompute/albums/72177720335186387/
Sponsorship and exhibit sales are already open for the 2027 OCP APAC Summit, taking place August 10 – 12 in Taipei, Taiwan. Details can be found here: https://www.opencompute.org/summit/2026-ocp-apac-summit/sponsorship-options
Those interested in participating at other OCP Events, find the full schedule here: https://www.opencompute.org/events/upcoming-event
The recordings of all the sessions, including the keynotes, will be available in the next week or two. You can find them here: https://www.opencompute.org/events/past-events
We look forward to seeing you at the next OCP event!