OCP Multi-Node Server with High Scalability
SV7100G4 is based on the specication of OCP Yosemite V3 that is built for Open Rack V2 architecture. It is a highly modularized system where you can fit server boards, expansion
boards, baseboard, power modules and cooling fans into a 4OU cubby chassis. The cubby can
carry 3 sleds with up to 4 blades in each sled, totaling to 12 blades, making it a highly scalable
system.
Power Eciency and Inference Capability for Specic Workloads
SV7100G4 utilizes 3rd Gen Intel Xeon Scalable processors (code name Cooper Lake) that
respectively supports Platinum SKU with low power consumption and high core count of 88
Wattage and 26 cores. The combination is power-efficient for workload of running web
services with simultaneous demands and, on top of that, it can do AI inference/ML works
with enhanced Intel® Deep Learning Boost with boat16 and AVX-512.
Blade Specifications:
Form Factor, Processor, Memory and Chipset
Form Factor: 1OU, one third width of OCP vCubby chassis
Processor: Intel® 3rd Generation Intel® Xeon® Scalable Processors
Processor Sockets: One per blade (4 server blades in a 1OU sled)
Chipsets: Intel® C621 series
System Bus: Intel® UltraPath Interconnect; 10.4GT/s
Memory: Up to 1.92TB, DDR4 up to 2666-3200MT/s, 6 RDIMM slots per blade
Storage and I/O
- Storage: One M.2 solid-state drives in 2280 or 22110 form factors
- Expansion Slots: One PCIex16 and one PCIex8 slots (Reserved)
- Front I/O:
- Power button x 1
- Status LEDs x 2
- LAN: Multi-host 100GbE OCP 3.0 NIC card (shared by 4 nodes)
- BMC Chipset: ASPEED AST2520
- Remote Management:
- NCSI port via multi-host OCP 3.0 NIC
- OpenBMC based SSH remote management
Physical Specifications
- Power Consumption: 130W ~ 165W (Max)
- Dimensions (mm): 185 (W) x 781 (D) x 173 (H)
- Weight: 19.5kg
Chassis Specifications:
- PSU: Centralized 12.5V DC bus bar
- Fan: Four 8030 fan modules (Per Sled), with one fan failure redundancy
- Dimensions (mm): 537 (W) * 801 (D) * 191 (H)
