OpenHBI-L Specification for Laminate Substrate V1.0

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Open Compute Project (OCP) Foundation

Product Details

This document defines the technical specifications for the OpenHBI-L under OCP Server project, ODSA subproject.

Scope of OpenHBI-L includes but not limited to the following:

  • DWORD and Bump signals definitions
  • PHY layer
  • Logical PHY layer
  • DWORD Bump pattern and signal ordering
  • Beachfront Orientation considerations
  • Beachfront Scalability
  • Bump pitch (Min-Max range)
  • IO electricals, Data Rates and Clocking
  • Chiplet Configuration interface
  • Test pattern generator and signal mapping
  • Reference laminate substrate media and channels
  • Reference Stackup and routing examples
  • Reference Initialization, Calibration and Training steps and register set

OpenHBI-L Specification for Laminate Substrate V1.0 Specification

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