Blue Cheetah is a leader in Die-to-Die (D2D) interconnect solutions for chiplets in very advanced and low-cost packaging applications. BlueLynx™ is a revolutionary D2D subsystem architecture enabling best in class optimized Power-Performance-Area (PPA) and drastically reduces customer time-to-market.
BlueLynx™ interconnect IP subsystem includes physical (PHY) and optional link layer for chiplet interfaces and supports Universal Chiplet Interconnect Express (UCIe), OpenCompute Project (OCP) Bunch of Wires (BoW), as well as custom applications.
The BlueLynx™ link layers connect to on-die buses/Networks-on-Chip (NoCs) with various standards, including AXI4, AXI5 lite, CHI, ACE, and more.
